JPS56163292A - Manufacture of fluid circuit plate - Google Patents

Manufacture of fluid circuit plate

Info

Publication number
JPS56163292A
JPS56163292A JP6785881A JP6785881A JPS56163292A JP S56163292 A JPS56163292 A JP S56163292A JP 6785881 A JP6785881 A JP 6785881A JP 6785881 A JP6785881 A JP 6785881A JP S56163292 A JPS56163292 A JP S56163292A
Authority
JP
Japan
Prior art keywords
plate
fluid circuit
mold
grooved
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6785881A
Other languages
Japanese (ja)
Inventor
Hiroyasu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Hokushin Electric Works Ltd
Yokogawa Hokushin Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokushin Electric Works Ltd, Yokogawa Hokushin Electric Corp filed Critical Hokushin Electric Works Ltd
Priority to JP6785881A priority Critical patent/JPS56163292A/en
Publication of JPS56163292A publication Critical patent/JPS56163292A/en
Pending legal-status Critical Current

Links

Landscapes

  • Fluid-Pressure Circuits (AREA)

Abstract

PURPOSE: To manufacture accurately and inexpensively a complex fluid circuit plate having deep grooves by forming a grooved plate by an electroforming method and joining it to a base plate with an adhesive.
CONSTITUTION: Grooves corresponding to the grooves 2a of a grooved plate 2 are cut in a base material to form a matrix. The grooved surface of the matrix is coated with a mold releasing agent and an electrically conductive coating and plated with copper or other metal. The plated part is detached and used as a mold for electroforming. The protruded surface of the mold is coated with a mold releasing agent and an electrically conductive coating and plated with copper or other metal to form a grooved plate 2 by electroforming. The plated part is detached from the mold to complete the electroformed grooved plate 2. By joining the groove side of the plate 2 to base plate 1 with an adhesive 3, a fluid circuit plate having a fluid circuit 4 is manufactured.
COPYRIGHT: (C)1981,JPO&Japio
JP6785881A 1981-05-06 1981-05-06 Manufacture of fluid circuit plate Pending JPS56163292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6785881A JPS56163292A (en) 1981-05-06 1981-05-06 Manufacture of fluid circuit plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6785881A JPS56163292A (en) 1981-05-06 1981-05-06 Manufacture of fluid circuit plate

Publications (1)

Publication Number Publication Date
JPS56163292A true JPS56163292A (en) 1981-12-15

Family

ID=13357052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6785881A Pending JPS56163292A (en) 1981-05-06 1981-05-06 Manufacture of fluid circuit plate

Country Status (1)

Country Link
JP (1) JPS56163292A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019021A (en) * 1973-05-18 1975-02-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5019021A (en) * 1973-05-18 1975-02-28

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