JPS56155511A - Resin mold electromagnetic apparatus - Google Patents
Resin mold electromagnetic apparatusInfo
- Publication number
- JPS56155511A JPS56155511A JP5873280A JP5873280A JPS56155511A JP S56155511 A JPS56155511 A JP S56155511A JP 5873280 A JP5873280 A JP 5873280A JP 5873280 A JP5873280 A JP 5873280A JP S56155511 A JPS56155511 A JP S56155511A
- Authority
- JP
- Japan
- Prior art keywords
- winding
- resin
- lead wire
- wound
- drawn upward
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/06—Insulation of windings
Abstract
PURPOSE:To obtain the resin mold apparatus excellent in dielectric strength by a method wherein a lead wire of each winding is drawn upward and integratedly molded by the resin together with the winding in such a manner of surrounding the rising part of the lead wire to form a winding unit. CONSTITUTION:A low voltage winding 10 is wound on an insulating bobbin 9 as large as cut cores 1A, 1B can be inserted, and the lead wire 10L is drawn upward. Then, a high voltage winding 12 is wound on an insulating bobbin 11 having an inner diameter larger than the outer diameter of the wound-up low voltage winding 10 and likewise, the lead wire 12L being drawn upward and the low and high voltage windings 11, 12 being concentrically arranged to be installed in a mold type. In this condition, molding resin is injected, the rising parts of the respective lead wires 10L, 12L also being molded at the same time and a projecting part 13A is formed integratedly with a resin molded layer 13 to be made the winding unit. The projecting part is housed in a magnetic shield frame body 14 in such that a prescribed gap is kept. Thereby, the resin molding device excellent in the dielectric strength can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5873280A JPS56155511A (en) | 1980-05-06 | 1980-05-06 | Resin mold electromagnetic apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5873280A JPS56155511A (en) | 1980-05-06 | 1980-05-06 | Resin mold electromagnetic apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56155511A true JPS56155511A (en) | 1981-12-01 |
JPS6161524B2 JPS6161524B2 (en) | 1986-12-26 |
Family
ID=13092672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5873280A Granted JPS56155511A (en) | 1980-05-06 | 1980-05-06 | Resin mold electromagnetic apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56155511A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019455A (en) * | 2003-06-23 | 2005-01-20 | Iq Four:Kk | High-voltage transformer |
-
1980
- 1980-05-06 JP JP5873280A patent/JPS56155511A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005019455A (en) * | 2003-06-23 | 2005-01-20 | Iq Four:Kk | High-voltage transformer |
Also Published As
Publication number | Publication date |
---|---|
JPS6161524B2 (en) | 1986-12-26 |
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