JPS56152972A - Etching device - Google Patents
Etching deviceInfo
- Publication number
- JPS56152972A JPS56152972A JP5467280A JP5467280A JPS56152972A JP S56152972 A JPS56152972 A JP S56152972A JP 5467280 A JP5467280 A JP 5467280A JP 5467280 A JP5467280 A JP 5467280A JP S56152972 A JPS56152972 A JP S56152972A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- etched
- acted
- blown
- close contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
PURPOSE: To obtain an etching device that can etch uniform and partial surfaces by so constituting the same that etching is performed by covering the areas not required to be etched out of semiconductor element surfaces with rubber provided with close contact means.
CONSTITUTION: After a semiconductor element 1 is placed on the top surface of an element holding part 2, it is centered by acting centering arms 6. Next, a vertical driving source 5 is acted to move a holding part 2 and cup part 4 carrying the element 1 upward by a fixed size to hold the element 1 between the part 2 and a cover shaft part 7 respectively in close contact therewith by the force of a panel 9 and to cover the part not to be etched. Next, the driving source 3 of the part 2 is acted to revolve the element 1, the part 2 and the shaft 7 synchronously. Thence, etchant is blown from an etching nozzle 10 and the element 1 is etched while being rotated. After etching for a fixed time, washing liquid is blown from a washing nozzle 13, whereby the element 1 is washed.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5467280A JPS56152972A (en) | 1980-04-24 | 1980-04-24 | Etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5467280A JPS56152972A (en) | 1980-04-24 | 1980-04-24 | Etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56152972A true JPS56152972A (en) | 1981-11-26 |
Family
ID=12977265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5467280A Pending JPS56152972A (en) | 1980-04-24 | 1980-04-24 | Etching device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56152972A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62235479A (en) * | 1986-04-03 | 1987-10-15 | Nippon Telegr & Teleph Corp <Ntt> | Method and device for etching |
-
1980
- 1980-04-24 JP JP5467280A patent/JPS56152972A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62235479A (en) * | 1986-04-03 | 1987-10-15 | Nippon Telegr & Teleph Corp <Ntt> | Method and device for etching |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5271871A (en) | Washing apparatus | |
| DE2965006D1 (en) | Method for the selective detection of defects, caused by polishing, on the surface of silicon wafers | |
| JPS551114A (en) | Method and device for washing wafer | |
| JPS56164549A (en) | Mounting method by positioning | |
| JPS5434751A (en) | Washing method for silicon wafer | |
| JPS56152972A (en) | Etching device | |
| JPS5468736A (en) | Etching device | |
| JPS56100433A (en) | Manufacture of semiconductor device | |
| JPS6418230A (en) | Manufacture of semiconductor device | |
| JPS5437581A (en) | Wafer etching device | |
| JPS5361974A (en) | Production of semiconductor device | |
| JPS57112756A (en) | Rotary spin processor turned upside down | |
| JPS57120672A (en) | Plasma etching method | |
| JPS5740931A (en) | Plasma processing device | |
| JPS548466A (en) | One side etching method of semiconductor wafer | |
| JPS5375866A (en) | Wafer transfer device | |
| JPS57154854A (en) | Processing device for plate type material | |
| JPS5219067A (en) | Breakaway separator of semiconductor wafer | |
| JPS52156177A (en) | Surface washing method of liquid treating membrane | |
| JPS54103270A (en) | Substrate cleaning apparatus | |
| JPS5432267A (en) | Liquid processing method for semiconductor wafer | |
| JPS5339872A (en) | Etching method of wafers | |
| JPS5422759A (en) | Handling method for semiconductor wafer | |
| JPS5667924A (en) | Preparation method of semiconductor system | |
| JPS54159870A (en) | Small piece washing method |