JPS56147458A - Semiconductor converter - Google Patents

Semiconductor converter

Info

Publication number
JPS56147458A
JPS56147458A JP5044880A JP5044880A JPS56147458A JP S56147458 A JPS56147458 A JP S56147458A JP 5044880 A JP5044880 A JP 5044880A JP 5044880 A JP5044880 A JP 5044880A JP S56147458 A JPS56147458 A JP S56147458A
Authority
JP
Japan
Prior art keywords
stages
cooling
temperature
piled
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5044880A
Other languages
Japanese (ja)
Inventor
Taichiro Yabuno
Hajime Arai
Shozo Takeda
Shigeo Shinohara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5044880A priority Critical patent/JPS56147458A/en
Publication of JPS56147458A publication Critical patent/JPS56147458A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To restrain the rise in temperature of the central stages of piled cooling bodies and obtain a semiconductor converter of excellent cooling performance by making the projecting length of the heat-shielding plates in the central stages longer than that of those in both end stages. CONSTITUTION:Because the projecting length of heat-shielding plates 26 and 27, on the semiconductor-mounting side, is made longer than that of the others, air streams C and D passing through cooling bodies 15 and 16 include larger amounts of cold air, and also the effect of the rise in temperature resulting from the radiation by respective lower stages is avoided. Moreover, owing to a baffle plate 35, it is made difficult for the cold air flowing in from a ventilating hole 37 to flow through the cubicle central portion. By said constitution, the cooling temperature in each stage of the piled cooling bodies is uniformed, so that excellent cooling performance can be obtained.
JP5044880A 1980-04-18 1980-04-18 Semiconductor converter Pending JPS56147458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5044880A JPS56147458A (en) 1980-04-18 1980-04-18 Semiconductor converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5044880A JPS56147458A (en) 1980-04-18 1980-04-18 Semiconductor converter

Publications (1)

Publication Number Publication Date
JPS56147458A true JPS56147458A (en) 1981-11-16

Family

ID=12859139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5044880A Pending JPS56147458A (en) 1980-04-18 1980-04-18 Semiconductor converter

Country Status (1)

Country Link
JP (1) JPS56147458A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030922A (en) * 1983-08-01 1985-02-16 Nippon Telegr & Teleph Corp <Ntt> Air conditioner for electronic device
JPS619890U (en) * 1984-06-20 1986-01-21 株式会社 三社電機製作所 Air-cooled electrical equipment
US4644443A (en) * 1985-09-27 1987-02-17 Texas Instruments Incorporated Computer cooling system using recycled coolant
US6704198B2 (en) * 2002-06-12 2004-03-09 Avava Technology Corp. Equipment enclosure with heat exchanger
US7085133B2 (en) * 2003-07-09 2006-08-01 International Business Machines Corporation Cooling using complimentary tapered plenums
US7236362B2 (en) * 2004-11-18 2007-06-26 Ncr Corporation Minimization of cooling air preheat for maximum packaging density

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6030922A (en) * 1983-08-01 1985-02-16 Nippon Telegr & Teleph Corp <Ntt> Air conditioner for electronic device
JPS619890U (en) * 1984-06-20 1986-01-21 株式会社 三社電機製作所 Air-cooled electrical equipment
US4644443A (en) * 1985-09-27 1987-02-17 Texas Instruments Incorporated Computer cooling system using recycled coolant
US6704198B2 (en) * 2002-06-12 2004-03-09 Avava Technology Corp. Equipment enclosure with heat exchanger
US7085133B2 (en) * 2003-07-09 2006-08-01 International Business Machines Corporation Cooling using complimentary tapered plenums
US7236362B2 (en) * 2004-11-18 2007-06-26 Ncr Corporation Minimization of cooling air preheat for maximum packaging density

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