JPS5614070A - Burying method of wire shaped copper body into copper material by solder - Google Patents

Burying method of wire shaped copper body into copper material by solder

Info

Publication number
JPS5614070A
JPS5614070A JP9051679A JP9051679A JPS5614070A JP S5614070 A JPS5614070 A JP S5614070A JP 9051679 A JP9051679 A JP 9051679A JP 9051679 A JP9051679 A JP 9051679A JP S5614070 A JPS5614070 A JP S5614070A
Authority
JP
Japan
Prior art keywords
solder
groove
copper material
solder bath
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9051679A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6232022B2 (enrdf_load_stackoverflow
Inventor
Deiitoritsuhi.Eerushiyureegeru
Hajime Abe
Koichi Tamura
Katsumi Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP9051679A priority Critical patent/JPS5614070A/ja
Publication of JPS5614070A publication Critical patent/JPS5614070A/ja
Publication of JPS6232022B2 publication Critical patent/JPS6232022B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)
JP9051679A 1979-07-16 1979-07-16 Burying method of wire shaped copper body into copper material by solder Granted JPS5614070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9051679A JPS5614070A (en) 1979-07-16 1979-07-16 Burying method of wire shaped copper body into copper material by solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9051679A JPS5614070A (en) 1979-07-16 1979-07-16 Burying method of wire shaped copper body into copper material by solder

Publications (2)

Publication Number Publication Date
JPS5614070A true JPS5614070A (en) 1981-02-10
JPS6232022B2 JPS6232022B2 (enrdf_load_stackoverflow) 1987-07-11

Family

ID=14000613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9051679A Granted JPS5614070A (en) 1979-07-16 1979-07-16 Burying method of wire shaped copper body into copper material by solder

Country Status (1)

Country Link
JP (1) JPS5614070A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2634630A (en) * 2023-08-31 2025-04-16 Tokamak Energy Ltd Superconducting magnet coil manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2634630A (en) * 2023-08-31 2025-04-16 Tokamak Energy Ltd Superconducting magnet coil manufacture

Also Published As

Publication number Publication date
JPS6232022B2 (enrdf_load_stackoverflow) 1987-07-11

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