JPS56138939A - Master slice type integrated circuit - Google Patents

Master slice type integrated circuit

Info

Publication number
JPS56138939A
JPS56138939A JP4164580A JP4164580A JPS56138939A JP S56138939 A JPS56138939 A JP S56138939A JP 4164580 A JP4164580 A JP 4164580A JP 4164580 A JP4164580 A JP 4164580A JP S56138939 A JPS56138939 A JP S56138939A
Authority
JP
Japan
Prior art keywords
pieces
integrated circuit
type integrated
conductor pieces
longitudinal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4164580A
Other languages
Japanese (ja)
Inventor
Kenji Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP4164580A priority Critical patent/JPS56138939A/en
Publication of JPS56138939A publication Critical patent/JPS56138939A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits

Abstract

PURPOSE:To improve the integrating density of a master silice type integrated circuit by varying the disposing state of conductor pieces or the like of common wiring pattern. CONSTITUTION:A plurality of longitudinal conductor pieces 13a (13a1-13a12) connected to an upper block row 111 and a plurality of longitudinal conductor pieces 13b (13b1-1312) connected to a lower block row 112 are confronted in the vicinity of the approximate center of a wire forming region 12 between the block rows 111 and 112. A plurality of longitudinal repeating conductor pieces 14 (141-144) electrically insulated from the blocks 111, 112 are disposed between the pieces 13a and 13b in desired array direction. A common wiring pattern is formed with the pieces 13a, 13b and the pieces 14. Further, the second layer wire 16 (161-168) becoming lateral wire and contact holes 17 are fomred, thereby forming an LSI connected with desired block.
JP4164580A 1980-03-31 1980-03-31 Master slice type integrated circuit Pending JPS56138939A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4164580A JPS56138939A (en) 1980-03-31 1980-03-31 Master slice type integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4164580A JPS56138939A (en) 1980-03-31 1980-03-31 Master slice type integrated circuit

Publications (1)

Publication Number Publication Date
JPS56138939A true JPS56138939A (en) 1981-10-29

Family

ID=12614068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4164580A Pending JPS56138939A (en) 1980-03-31 1980-03-31 Master slice type integrated circuit

Country Status (1)

Country Link
JP (1) JPS56138939A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63138A (en) * 1986-06-19 1988-01-05 Nec Corp Integrated circuit device
JPH01144649A (en) * 1987-11-30 1989-06-06 Sharp Corp Wiring structure of integrated circuit
JPH02164064A (en) * 1988-12-19 1990-06-25 Rohm Co Ltd Manufacture of semiconductor integrated circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63138A (en) * 1986-06-19 1988-01-05 Nec Corp Integrated circuit device
JPH01144649A (en) * 1987-11-30 1989-06-06 Sharp Corp Wiring structure of integrated circuit
JPH02164064A (en) * 1988-12-19 1990-06-25 Rohm Co Ltd Manufacture of semiconductor integrated circuit

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