JPS56136967A - Method and apparatus for deionizing chemical copper plating bath - Google Patents
Method and apparatus for deionizing chemical copper plating bathInfo
- Publication number
- JPS56136967A JPS56136967A JP3823680A JP3823680A JPS56136967A JP S56136967 A JPS56136967 A JP S56136967A JP 3823680 A JP3823680 A JP 3823680A JP 3823680 A JP3823680 A JP 3823680A JP S56136967 A JPS56136967 A JP S56136967A
- Authority
- JP
- Japan
- Prior art keywords
- vessel
- bath
- ions
- plating
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To regenerate an worn-out chemical copper plating bath and prevent the deterioration of a plated film in the mechanical properties by electrodialyzing the bath with deteriorated performance after pH adjustment.
CONSTITUTION: When a chemical copper plating bath made of aqueous soln. contg. Cu ions, a Cu ion reducing agent, a chelating agent and alkali metal hydroxide is used in plating and deteriorated in the plating power, it is poured into pH adjusting vessel 5 from plating vessel 1. By adding one or more kinds of acids such as sulfuric acid, perchloric acid, formic acid and acetic acid to vessel 5 from acid vessel 6, the bath is adjusted to 2W8pH to release carbonate ions as gaseous CO2. It is then adjusted to 8W11pH and fed to desalting chamber 2 of electrodialytic vessel 1 to remove HCO3 -, Na+ and other ions. The harmful ions discharged and accumulated in concn. chamber 3 of vessel 1 are refluxed to concd. soln. vessel 7. Thus, said plating bath is regenerated.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3823680A JPS56136967A (en) | 1980-03-27 | 1980-03-27 | Method and apparatus for deionizing chemical copper plating bath |
US06/160,201 US4324629A (en) | 1979-06-19 | 1980-06-17 | Process for regenerating chemical copper plating solution |
NLAANVRAGE8003553,A NL188683C (en) | 1979-06-19 | 1980-06-19 | METHOD FOR REGENERATING A BATH FOR CHEMICAL COPYING. |
DE3022962A DE3022962C2 (en) | 1979-06-19 | 1980-06-19 | Process for regenerating a chemical copper plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3823680A JPS56136967A (en) | 1980-03-27 | 1980-03-27 | Method and apparatus for deionizing chemical copper plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56136967A true JPS56136967A (en) | 1981-10-26 |
JPS6225749B2 JPS6225749B2 (en) | 1987-06-04 |
Family
ID=12519657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3823680A Granted JPS56136967A (en) | 1979-06-19 | 1980-03-27 | Method and apparatus for deionizing chemical copper plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56136967A (en) |
-
1980
- 1980-03-27 JP JP3823680A patent/JPS56136967A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6225749B2 (en) | 1987-06-04 |
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