JPS56130936A - Inspecting apparatus for semiconductor wafer - Google Patents
Inspecting apparatus for semiconductor waferInfo
- Publication number
- JPS56130936A JPS56130936A JP3444480A JP3444480A JPS56130936A JP S56130936 A JPS56130936 A JP S56130936A JP 3444480 A JP3444480 A JP 3444480A JP 3444480 A JP3444480 A JP 3444480A JP S56130936 A JPS56130936 A JP S56130936A
- Authority
- JP
- Japan
- Prior art keywords
- measured
- base
- wafer
- chip
- sample chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Abstract
PURPOSE:To automatically decide the existence or absence of a malfunction in a measuring system by placing a chip as a reference on another base integrated with a wafer base for placing a wafer to be measured and measuring the reference chip as required. CONSTITUTION:A sample chip 20 as a reference is placed on a sample chip base 16 integrated with a base 12 of a wafer to be measured, a pattern in the sample chip is positioned to match with a probe as to their displacement by X- and Y-axis step motors 4, 5 and rotary motor 7. The moving distances and rotating amount of the X- and Y-axis are read at this time, a water 14 to be measured and placed on the base 12 is positioned for an automatic measurement. Thus the sample chip is measured as required, and it can clearly decide whether a malfunction occurs in the wafer to be measured or in the measuring system.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3444480A JPS56130936A (en) | 1980-03-18 | 1980-03-18 | Inspecting apparatus for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3444480A JPS56130936A (en) | 1980-03-18 | 1980-03-18 | Inspecting apparatus for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56130936A true JPS56130936A (en) | 1981-10-14 |
Family
ID=12414405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3444480A Pending JPS56130936A (en) | 1980-03-18 | 1980-03-18 | Inspecting apparatus for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56130936A (en) |
-
1980
- 1980-03-18 JP JP3444480A patent/JPS56130936A/en active Pending
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