JPS56122824A - Resin composition for electric insulation - Google Patents

Resin composition for electric insulation

Info

Publication number
JPS56122824A
JPS56122824A JP2762880A JP2762880A JPS56122824A JP S56122824 A JPS56122824 A JP S56122824A JP 2762880 A JP2762880 A JP 2762880A JP 2762880 A JP2762880 A JP 2762880A JP S56122824 A JPS56122824 A JP S56122824A
Authority
JP
Japan
Prior art keywords
molded
electric device
polyglycol
resin composition
100pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2762880A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6231005B2 (enrdf_load_stackoverflow
Inventor
Masamitsu Tsushima
Mitsuru Oyamada
Tamio Takeda
Saburo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2762880A priority Critical patent/JPS56122824A/ja
Publication of JPS56122824A publication Critical patent/JPS56122824A/ja
Publication of JPS6231005B2 publication Critical patent/JPS6231005B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP2762880A 1980-03-05 1980-03-05 Resin composition for electric insulation Granted JPS56122824A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2762880A JPS56122824A (en) 1980-03-05 1980-03-05 Resin composition for electric insulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2762880A JPS56122824A (en) 1980-03-05 1980-03-05 Resin composition for electric insulation

Publications (2)

Publication Number Publication Date
JPS56122824A true JPS56122824A (en) 1981-09-26
JPS6231005B2 JPS6231005B2 (enrdf_load_stackoverflow) 1987-07-06

Family

ID=12226215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2762880A Granted JPS56122824A (en) 1980-03-05 1980-03-05 Resin composition for electric insulation

Country Status (1)

Country Link
JP (1) JPS56122824A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333416A (ja) * 1986-07-28 1988-02-13 Toshiba Chem Corp 封止用樹脂組成物
EP0446580A1 (en) * 1990-03-14 1991-09-18 International Business Machines Corporation Solder interconnection structure with encapsulant and composition of the latter
EP0446666A3 (en) * 1990-03-14 1992-01-08 International Business Machines Corporation Solder interconnection structure on organic substrates and process for making

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945995A (enrdf_load_stackoverflow) * 1972-09-07 1974-05-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945995A (enrdf_load_stackoverflow) * 1972-09-07 1974-05-02

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333416A (ja) * 1986-07-28 1988-02-13 Toshiba Chem Corp 封止用樹脂組成物
EP0446580A1 (en) * 1990-03-14 1991-09-18 International Business Machines Corporation Solder interconnection structure with encapsulant and composition of the latter
EP0446666A3 (en) * 1990-03-14 1992-01-08 International Business Machines Corporation Solder interconnection structure on organic substrates and process for making
US5292688A (en) * 1990-03-14 1994-03-08 International Business Machines Corporation Solder interconnection structure on organic substrates and process for making

Also Published As

Publication number Publication date
JPS6231005B2 (enrdf_load_stackoverflow) 1987-07-06

Similar Documents

Publication Publication Date Title
JPS559626A (en) Epoxy resin composition
JPS56122824A (en) Resin composition for electric insulation
JPS5659837A (en) Epoxy resin composition
JPS5657820A (en) Curable epoxy resin composition
JPS5388097A (en) Epoxy resin composition
JPS53134099A (en) Heat-resistant resin composition
JPS51131526A (en) Resin composition for use in powder coating
JPS53144958A (en) Epoxy resin composition
JPS5316099A (en) Heat-resistant resin composition
JPS55137153A (en) Electrical insulating resin composition
JPS51135999A (en) Epoxy res in composition
JPS5414499A (en) Heat resistant resin composition
JPS5778447A (en) Phenolic resin molding material
JPS57210647A (en) Semiconductor device
JPS57187325A (en) Production of epoxy resin laminated sheet
JPS56100871A (en) Manufacture of coating composition for magnetic film
JPS55118920A (en) Curable epoxy resin composition
JPS5571719A (en) Epoxy resin composition having improved crack resistance
JPS57190018A (en) Epoxy resin composition
JPS5368900A (en) Heat-proof insulation layer-built unit and preparation
JPS562341A (en) Epoxy resin casting material
JPS555963A (en) Epoxy resin composition
JPS57179272A (en) Binding tape for electrical apparatus
JPS57202347A (en) Electricially conductive resin composition for plating and its production
JPS5725322A (en) Epoxy resin composition