JPS56118346A - Gang bonding device - Google Patents

Gang bonding device

Info

Publication number
JPS56118346A
JPS56118346A JP2240680A JP2240680A JPS56118346A JP S56118346 A JPS56118346 A JP S56118346A JP 2240680 A JP2240680 A JP 2240680A JP 2240680 A JP2240680 A JP 2240680A JP S56118346 A JPS56118346 A JP S56118346A
Authority
JP
Japan
Prior art keywords
junction
tool
divergence
prism
tools
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2240680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249983B2 (cg-RX-API-DMAC7.html
Inventor
Junji Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP2240680A priority Critical patent/JPS56118346A/ja
Publication of JPS56118346A publication Critical patent/JPS56118346A/ja
Publication of JPS6249983B2 publication Critical patent/JPS6249983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2240680A 1980-02-25 1980-02-25 Gang bonding device Granted JPS56118346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2240680A JPS56118346A (en) 1980-02-25 1980-02-25 Gang bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2240680A JPS56118346A (en) 1980-02-25 1980-02-25 Gang bonding device

Publications (2)

Publication Number Publication Date
JPS56118346A true JPS56118346A (en) 1981-09-17
JPS6249983B2 JPS6249983B2 (cg-RX-API-DMAC7.html) 1987-10-22

Family

ID=12081777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2240680A Granted JPS56118346A (en) 1980-02-25 1980-02-25 Gang bonding device

Country Status (1)

Country Link
JP (1) JPS56118346A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03160737A (ja) * 1989-11-20 1991-07-10 Marine Instr Co Ltd テープボンディング方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03160737A (ja) * 1989-11-20 1991-07-10 Marine Instr Co Ltd テープボンディング方法

Also Published As

Publication number Publication date
JPS6249983B2 (cg-RX-API-DMAC7.html) 1987-10-22

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