JPS56116644A - Manufacture device - Google Patents

Manufacture device

Info

Publication number
JPS56116644A
JPS56116644A JP1899580A JP1899580A JPS56116644A JP S56116644 A JPS56116644 A JP S56116644A JP 1899580 A JP1899580 A JP 1899580A JP 1899580 A JP1899580 A JP 1899580A JP S56116644 A JPS56116644 A JP S56116644A
Authority
JP
Japan
Prior art keywords
magazine
chute
works
gate
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1899580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6257104B2 (online.php
Inventor
Toshio Hoshino
Noriaki Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1899580A priority Critical patent/JPS56116644A/ja
Publication of JPS56116644A publication Critical patent/JPS56116644A/ja
Publication of JPS6257104B2 publication Critical patent/JPS6257104B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1899580A 1980-02-20 1980-02-20 Manufacture device Granted JPS56116644A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1899580A JPS56116644A (en) 1980-02-20 1980-02-20 Manufacture device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1899580A JPS56116644A (en) 1980-02-20 1980-02-20 Manufacture device

Publications (2)

Publication Number Publication Date
JPS56116644A true JPS56116644A (en) 1981-09-12
JPS6257104B2 JPS6257104B2 (online.php) 1987-11-30

Family

ID=11987138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1899580A Granted JPS56116644A (en) 1980-02-20 1980-02-20 Manufacture device

Country Status (1)

Country Link
JP (1) JPS56116644A (online.php)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443927A (en) * 1981-11-23 1984-04-24 Cargill Detroit Corp. Sucker rod machining system
JPS59112942U (ja) * 1983-01-20 1984-07-30 丸豊精工株式会社 Ｉｃ素子の検査装置
JPS6068645U (ja) * 1983-10-17 1985-05-15 株式会社アドバンテスト Ｉｃ試験装置
JPS611097A (ja) * 1984-06-14 1986-01-07 日立電子エンジニアリング株式会社 マガジン自動供給装置
JPS61188332A (ja) * 1985-02-13 1986-08-22 Hitachi Electronics Eng Co Ltd 電子部品の加工装置
JPS63318757A (ja) * 1987-06-22 1988-12-27 Nec Corp 半導体製造装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443927A (en) * 1981-11-23 1984-04-24 Cargill Detroit Corp. Sucker rod machining system
JPS59112942U (ja) * 1983-01-20 1984-07-30 丸豊精工株式会社 Ｉｃ素子の検査装置
JPS6068645U (ja) * 1983-10-17 1985-05-15 株式会社アドバンテスト Ｉｃ試験装置
JPS611097A (ja) * 1984-06-14 1986-01-07 日立電子エンジニアリング株式会社 マガジン自動供給装置
JPS61188332A (ja) * 1985-02-13 1986-08-22 Hitachi Electronics Eng Co Ltd 電子部品の加工装置
JPS63318757A (ja) * 1987-06-22 1988-12-27 Nec Corp 半導体製造装置

Also Published As

Publication number Publication date
JPS6257104B2 (online.php) 1987-11-30

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