JPS56113110A - Hermetic sealing method of light emission element package provided with optical fiber - Google Patents

Hermetic sealing method of light emission element package provided with optical fiber

Info

Publication number
JPS56113110A
JPS56113110A JP1553580A JP1553580A JPS56113110A JP S56113110 A JPS56113110 A JP S56113110A JP 1553580 A JP1553580 A JP 1553580A JP 1553580 A JP1553580 A JP 1553580A JP S56113110 A JPS56113110 A JP S56113110A
Authority
JP
Japan
Prior art keywords
solder
opening part
holder
optical fiber
light emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1553580A
Other languages
Japanese (ja)
Inventor
Kyozo Kaise
Katsuki Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1553580A priority Critical patent/JPS56113110A/en
Publication of JPS56113110A publication Critical patent/JPS56113110A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall

Abstract

PURPOSE:To improve both airtightness and assemblability by using a solder of a low melting point as a brazing material for fixing the holder, also heating the opening part locally and swiftly by using a coil heater, and melting the solder. CONSTITUTION:A solder whose melting point is comparatively low is used for a brazing material 19 which fills the space 18 between the opening part 6 of the cap 5, and the holder 8, and brazes both of them, and it is formed in a ring-shape of a solder wire and is placed on the end of the opening part 6. Subsequently, a coil heater 20 is placed so as to surround the opening part 6, the electric power supply is turned on, only the inside of the heater 20 is heated locally, and the solder 19 is melted. As a result, the molten solder flows into the gap 18 between the holder 8 and the opening part 6, and the holder 8 and the opening part 6 are fixed firmly. Accordingly, the lower part of the cap 5 and the stem 2 are not heated at all, and it is possible to prevent such a trouble as the solder for mixing the silicon submount 3 is melted.
JP1553580A 1980-02-13 1980-02-13 Hermetic sealing method of light emission element package provided with optical fiber Pending JPS56113110A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1553580A JPS56113110A (en) 1980-02-13 1980-02-13 Hermetic sealing method of light emission element package provided with optical fiber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1553580A JPS56113110A (en) 1980-02-13 1980-02-13 Hermetic sealing method of light emission element package provided with optical fiber

Publications (1)

Publication Number Publication Date
JPS56113110A true JPS56113110A (en) 1981-09-05

Family

ID=11891494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1553580A Pending JPS56113110A (en) 1980-02-13 1980-02-13 Hermetic sealing method of light emission element package provided with optical fiber

Country Status (1)

Country Link
JP (1) JPS56113110A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548466A (en) * 1982-09-29 1985-10-22 Evans Dain S Optical fibre coupling assemblies
JPH0949945A (en) * 1995-08-10 1997-02-18 Nec Corp Hermetic sealing device and method for optical semiconductor element module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5476975A (en) * 1977-11-30 1979-06-20 Sanyo Electric Co Soldering method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5476975A (en) * 1977-11-30 1979-06-20 Sanyo Electric Co Soldering method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548466A (en) * 1982-09-29 1985-10-22 Evans Dain S Optical fibre coupling assemblies
JPH0949945A (en) * 1995-08-10 1997-02-18 Nec Corp Hermetic sealing device and method for optical semiconductor element module

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