JPS56105892A - Soft soldering material - Google Patents

Soft soldering material

Info

Publication number
JPS56105892A
JPS56105892A JP697080A JP697080A JPS56105892A JP S56105892 A JPS56105892 A JP S56105892A JP 697080 A JP697080 A JP 697080A JP 697080 A JP697080 A JP 697080A JP S56105892 A JPS56105892 A JP S56105892A
Authority
JP
Japan
Prior art keywords
soldering material
contain
solid solution
precipitation
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP697080A
Other languages
Japanese (ja)
Inventor
Kisaku Nakamura
Koichiro Inomata
Senji Shimanuki
Akio Hori
Norio Ozawa
Takao Sawa
Tetsuo Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP697080A priority Critical patent/JPS56105892A/en
Publication of JPS56105892A publication Critical patent/JPS56105892A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent

Abstract

PURPOSE:To obtain a Pb-base soft soldering material being improved in its ductility as well as thermal fatigue characteristics etc. and capable of conforming to a preforming material for semiconductor, by adding specific quantities of Sn and In so as to be kept in Pb as a state of solid solution or precipitation. CONSTITUTION:A soldering material is to contain more than one element out of 0.5-22wt% Sn and 25-55% In in Pb as a state of solid solution or distributed precipitation of <=1mu particles, or a soldering material is to contain 1.5-15% Sn and more than one element of 2.5-15% Sb, <=12% Au and <=12% Al are contained as additives in Pb instead of a part of Pb. This soldering material is for instance, manufactured as follows; the raw alloy material is remelted in a tubular vessel 1 and the resulted molten material 2 is ejected through a nozzle 3 onto a roll 4 rotating with high speed by exerting the pressure of inert gas and quenched thereon to form a metallic foil. this soldering material has a stable characteristic so as to control the chance of currying of oxide and withstand the heat cycling, etc.
JP697080A 1980-01-25 1980-01-25 Soft soldering material Pending JPS56105892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP697080A JPS56105892A (en) 1980-01-25 1980-01-25 Soft soldering material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP697080A JPS56105892A (en) 1980-01-25 1980-01-25 Soft soldering material

Publications (1)

Publication Number Publication Date
JPS56105892A true JPS56105892A (en) 1981-08-22

Family

ID=11653048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP697080A Pending JPS56105892A (en) 1980-01-25 1980-01-25 Soft soldering material

Country Status (1)

Country Link
JP (1) JPS56105892A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144998A2 (en) * 1983-12-13 1985-06-19 Allied Corporation Rapid solidified soldering filler metals
CN104722963A (en) * 2013-12-18 2015-06-24 上海大华新型钎焊材料厂（普通合伙） Preparation method of silver-copper-phosphorus solder soldering lug

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0144998A2 (en) * 1983-12-13 1985-06-19 Allied Corporation Rapid solidified soldering filler metals
CN104722963A (en) * 2013-12-18 2015-06-24 上海大华新型钎焊材料厂（普通合伙） Preparation method of silver-copper-phosphorus solder soldering lug

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