JPS56105655A - Soldering method of lead wire - Google Patents
Soldering method of lead wireInfo
- Publication number
- JPS56105655A JPS56105655A JP792380A JP792380A JPS56105655A JP S56105655 A JPS56105655 A JP S56105655A JP 792380 A JP792380 A JP 792380A JP 792380 A JP792380 A JP 792380A JP S56105655 A JPS56105655 A JP S56105655A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- jig
- layer
- cleeping
- nonelectrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title abstract 7
- 238000005476 soldering Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000009194 climbing Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 230000007935 neutral effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4875—Connection or disconnection of other leads to or from bases or plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP792380A JPS56105655A (en) | 1980-01-25 | 1980-01-25 | Soldering method of lead wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP792380A JPS56105655A (en) | 1980-01-25 | 1980-01-25 | Soldering method of lead wire |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56105655A true JPS56105655A (en) | 1981-08-22 |
JPS6258153B2 JPS6258153B2 (enrdf_load_stackoverflow) | 1987-12-04 |
Family
ID=11679041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP792380A Granted JPS56105655A (en) | 1980-01-25 | 1980-01-25 | Soldering method of lead wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56105655A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62103258U (enrdf_load_stackoverflow) * | 1985-12-19 | 1987-07-01 |
-
1980
- 1980-01-25 JP JP792380A patent/JPS56105655A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62103258U (enrdf_load_stackoverflow) * | 1985-12-19 | 1987-07-01 |
Also Published As
Publication number | Publication date |
---|---|
JPS6258153B2 (enrdf_load_stackoverflow) | 1987-12-04 |
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