JPS56105655A - Soldering method of lead wire - Google Patents

Soldering method of lead wire

Info

Publication number
JPS56105655A
JPS56105655A JP792380A JP792380A JPS56105655A JP S56105655 A JPS56105655 A JP S56105655A JP 792380 A JP792380 A JP 792380A JP 792380 A JP792380 A JP 792380A JP S56105655 A JPS56105655 A JP S56105655A
Authority
JP
Japan
Prior art keywords
lead wire
jig
layer
cleeping
nonelectrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP792380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6258153B2 (enrdf_load_stackoverflow
Inventor
Masao Nishiyama
Masatoshi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP792380A priority Critical patent/JPS56105655A/ja
Publication of JPS56105655A publication Critical patent/JPS56105655A/ja
Publication of JPS6258153B2 publication Critical patent/JPS6258153B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4875Connection or disconnection of other leads to or from bases or plates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Chemically Coating (AREA)
JP792380A 1980-01-25 1980-01-25 Soldering method of lead wire Granted JPS56105655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP792380A JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP792380A JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Publications (2)

Publication Number Publication Date
JPS56105655A true JPS56105655A (en) 1981-08-22
JPS6258153B2 JPS6258153B2 (enrdf_load_stackoverflow) 1987-12-04

Family

ID=11679041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP792380A Granted JPS56105655A (en) 1980-01-25 1980-01-25 Soldering method of lead wire

Country Status (1)

Country Link
JP (1) JPS56105655A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103258U (enrdf_load_stackoverflow) * 1985-12-19 1987-07-01

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62103258U (enrdf_load_stackoverflow) * 1985-12-19 1987-07-01

Also Published As

Publication number Publication date
JPS6258153B2 (enrdf_load_stackoverflow) 1987-12-04

Similar Documents

Publication Publication Date Title
JPS56105655A (en) Soldering method of lead wire
SE8304020D0 (sv) Vid hoga temperaturer sjelvsmorjande lager och forfarande for tillverkning av detsamma
JPS57158174A (en) Car assembly method and its device
NO843393L (no) Aktiverte elektroder paa basis av ni, co, fe med aktivt belegg og fremgangsmaate til fremstilling derav
JPS5724551A (en) Manufacture of airtight terminal
JPS5426253A (en) Welding method for tip end of plate-shaped body
JPS5772354A (en) Package for semiconductor device
JPS567456A (en) Manufacture of airtight sealing body
JPS56129349A (en) Method of manufacturing airtight terminal
JPS5752590A (en) Au alloy brazing filler metal of low melting point
JPS5547250A (en) Attaching structure for metal body to glass body
JPS5724550A (en) Manufacture of airtight terminal
JPS57192057A (en) Semiconductor device
JPS56155557A (en) Semiconductor device
JPS577846A (en) Attaching method for metallic ring and solder glass to insulating pipe
JPS53112242A (en) Soldering method
JPS57122548A (en) Stem
JPS53137055A (en) Solder
JPS56103380A (en) Production of timepiece parts
JPS5430509A (en) Automatic pump
JPS53122653A (en) Phosphorcopper solder and method of fabricating the same
JPS57105706A (en) Protective tube containing type metal coated optical fiber
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS647547A (en) Resin-sealed semiconductor device
JPS52129280A (en) Wire bonding method