JPS56104137U - - Google Patents

Info

Publication number
JPS56104137U
JPS56104137U JP1981002898U JP289881U JPS56104137U JP S56104137 U JPS56104137 U JP S56104137U JP 1981002898 U JP1981002898 U JP 1981002898U JP 289881 U JP289881 U JP 289881U JP S56104137 U JPS56104137 U JP S56104137U
Authority
JP
Japan
Prior art keywords
surface portions
conductor
semi
face
circumferential surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981002898U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS56104137U publication Critical patent/JPS56104137U/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)
  • Molten Solder (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1981002898U 1971-05-05 1981-01-14 Pending JPS56104137U (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2122104A DE2122104C3 (de) 1971-05-05 1971-05-05 Verfahren zum Anlöten eines metallischen Anschlußleiters an einen Halbleiterkörper

Publications (1)

Publication Number Publication Date
JPS56104137U true JPS56104137U (enExample) 1981-08-14

Family

ID=5806863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981002898U Pending JPS56104137U (enExample) 1971-05-05 1981-01-14

Country Status (9)

Country Link
US (1) US3791019A (enExample)
JP (1) JPS56104137U (enExample)
AU (1) AU467996B2 (enExample)
DE (1) DE2122104C3 (enExample)
ES (1) ES402040A1 (enExample)
FR (1) FR2135335B1 (enExample)
GB (1) GB1388465A (enExample)
IT (1) IT953602B (enExample)
NL (1) NL164701C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH600739A5 (enExample) * 1975-05-19 1978-06-30 Suisse Horlogerie
US6090643A (en) 1998-08-17 2000-07-18 Teccor Electronics, L.P. Semiconductor chip-substrate attachment structure
DE10143915A1 (de) * 2001-09-07 2003-03-27 Newfrey Llc Lötverfahren für metallische Befestigungselemente

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE571348A (enExample) * 1957-09-20 1900-01-01
US3202489A (en) * 1959-12-01 1965-08-24 Hughes Aircraft Co Gold-aluminum alloy bond electrode attachment
US2987597A (en) * 1959-12-22 1961-06-06 Philco Corp Electrical component assembly
US3209450A (en) * 1962-07-03 1965-10-05 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3648915A (en) * 1967-02-24 1972-03-14 Bosch Gmbh Robert Arrangement for soldering a terminal to a semiconductor
US3446912A (en) * 1967-08-16 1969-05-27 Trw Inc Terminal for electrical component
GB1263703A (en) * 1968-08-09 1972-02-16 Lucas Industries Ltd Method of making connections to semi-conductor devices

Also Published As

Publication number Publication date
IT953602B (it) 1973-08-10
FR2135335A1 (enExample) 1972-12-15
US3791019A (en) 1974-02-12
NL7204147A (enExample) 1972-11-07
AU467996B2 (en) 1975-12-18
ES402040A1 (es) 1975-03-16
NL164701B (nl) 1980-08-15
DE2122104B2 (de) 1978-01-19
DE2122104C3 (de) 1979-08-23
DE2122104A1 (de) 1972-11-16
GB1388465A (en) 1975-03-26
AU4190572A (en) 1973-12-20
FR2135335B1 (enExample) 1976-08-06
NL164701C (nl) 1981-01-15

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