FR2135335B1 - - Google Patents

Info

Publication number
FR2135335B1
FR2135335B1 FR7216173A FR7216173A FR2135335B1 FR 2135335 B1 FR2135335 B1 FR 2135335B1 FR 7216173 A FR7216173 A FR 7216173A FR 7216173 A FR7216173 A FR 7216173A FR 2135335 B1 FR2135335 B1 FR 2135335B1
Authority
FR
France
Prior art keywords
surface portions
conductor
semi
face
circumferential surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7216173A
Other languages
English (en)
French (fr)
Other versions
FR2135335A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2135335A1 publication Critical patent/FR2135335A1/fr
Application granted granted Critical
Publication of FR2135335B1 publication Critical patent/FR2135335B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)
  • Molten Solder (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR7216173A 1971-05-05 1972-05-05 Expired FR2135335B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2122104A DE2122104C3 (de) 1971-05-05 1971-05-05 Verfahren zum Anlöten eines metallischen Anschlußleiters an einen Halbleiterkörper

Publications (2)

Publication Number Publication Date
FR2135335A1 FR2135335A1 (enExample) 1972-12-15
FR2135335B1 true FR2135335B1 (enExample) 1976-08-06

Family

ID=5806863

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7216173A Expired FR2135335B1 (enExample) 1971-05-05 1972-05-05

Country Status (9)

Country Link
US (1) US3791019A (enExample)
JP (1) JPS56104137U (enExample)
AU (1) AU467996B2 (enExample)
DE (1) DE2122104C3 (enExample)
ES (1) ES402040A1 (enExample)
FR (1) FR2135335B1 (enExample)
GB (1) GB1388465A (enExample)
IT (1) IT953602B (enExample)
NL (1) NL164701C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH600739A5 (enExample) * 1975-05-19 1978-06-30 Suisse Horlogerie
US6090643A (en) 1998-08-17 2000-07-18 Teccor Electronics, L.P. Semiconductor chip-substrate attachment structure
DE10143915A1 (de) * 2001-09-07 2003-03-27 Newfrey Llc Lötverfahren für metallische Befestigungselemente

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE571348A (enExample) * 1957-09-20 1900-01-01
US3202489A (en) * 1959-12-01 1965-08-24 Hughes Aircraft Co Gold-aluminum alloy bond electrode attachment
US2987597A (en) * 1959-12-22 1961-06-06 Philco Corp Electrical component assembly
US3209450A (en) * 1962-07-03 1965-10-05 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3648915A (en) * 1967-02-24 1972-03-14 Bosch Gmbh Robert Arrangement for soldering a terminal to a semiconductor
US3446912A (en) * 1967-08-16 1969-05-27 Trw Inc Terminal for electrical component
GB1263703A (en) * 1968-08-09 1972-02-16 Lucas Industries Ltd Method of making connections to semi-conductor devices

Also Published As

Publication number Publication date
IT953602B (it) 1973-08-10
FR2135335A1 (enExample) 1972-12-15
JPS56104137U (enExample) 1981-08-14
US3791019A (en) 1974-02-12
NL7204147A (enExample) 1972-11-07
AU467996B2 (en) 1975-12-18
ES402040A1 (es) 1975-03-16
NL164701B (nl) 1980-08-15
DE2122104B2 (de) 1978-01-19
DE2122104C3 (de) 1979-08-23
DE2122104A1 (de) 1972-11-16
GB1388465A (en) 1975-03-26
AU4190572A (en) 1973-12-20
NL164701C (nl) 1981-01-15

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Legal Events

Date Code Title Description
ST Notification of lapse