AU467996B2 - Method of soldering a metal terminal toa semiconductor body - Google Patents

Method of soldering a metal terminal toa semiconductor body

Info

Publication number
AU467996B2
AU467996B2 AU41905/72A AU4190572A AU467996B2 AU 467996 B2 AU467996 B2 AU 467996B2 AU 41905/72 A AU41905/72 A AU 41905/72A AU 4190572 A AU4190572 A AU 4190572A AU 467996 B2 AU467996 B2 AU 467996B2
Authority
AU
Australia
Prior art keywords
soldering
semiconductor body
metal terminal
terminal toa
toa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU41905/72A
Other languages
English (en)
Other versions
AU4190572A (en
Inventor
Schmidt Gunther
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of AU4190572A publication Critical patent/AU4190572A/en
Application granted granted Critical
Publication of AU467996B2 publication Critical patent/AU467996B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)
  • Molten Solder (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AU41905/72A 1971-05-05 1972-05-04 Method of soldering a metal terminal toa semiconductor body Expired AU467996B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEDE82122 1971-05-05
DE2122104A DE2122104C3 (de) 1971-05-05 1971-05-05 Verfahren zum Anlöten eines metallischen Anschlußleiters an einen Halbleiterkörper

Publications (2)

Publication Number Publication Date
AU4190572A AU4190572A (en) 1973-12-20
AU467996B2 true AU467996B2 (en) 1975-12-18

Family

ID=5806863

Family Applications (1)

Application Number Title Priority Date Filing Date
AU41905/72A Expired AU467996B2 (en) 1971-05-05 1972-05-04 Method of soldering a metal terminal toa semiconductor body

Country Status (9)

Country Link
US (1) US3791019A (enExample)
JP (1) JPS56104137U (enExample)
AU (1) AU467996B2 (enExample)
DE (1) DE2122104C3 (enExample)
ES (1) ES402040A1 (enExample)
FR (1) FR2135335B1 (enExample)
GB (1) GB1388465A (enExample)
IT (1) IT953602B (enExample)
NL (1) NL164701C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH600739A5 (enExample) * 1975-05-19 1978-06-30 Suisse Horlogerie
US6090643A (en) 1998-08-17 2000-07-18 Teccor Electronics, L.P. Semiconductor chip-substrate attachment structure
DE10143915A1 (de) * 2001-09-07 2003-03-27 Newfrey Llc Lötverfahren für metallische Befestigungselemente

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE571348A (enExample) * 1957-09-20 1900-01-01
US3202489A (en) * 1959-12-01 1965-08-24 Hughes Aircraft Co Gold-aluminum alloy bond electrode attachment
US2987597A (en) * 1959-12-22 1961-06-06 Philco Corp Electrical component assembly
US3209450A (en) * 1962-07-03 1965-10-05 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3648915A (en) * 1967-02-24 1972-03-14 Bosch Gmbh Robert Arrangement for soldering a terminal to a semiconductor
US3446912A (en) * 1967-08-16 1969-05-27 Trw Inc Terminal for electrical component
GB1263703A (en) * 1968-08-09 1972-02-16 Lucas Industries Ltd Method of making connections to semi-conductor devices

Also Published As

Publication number Publication date
IT953602B (it) 1973-08-10
FR2135335A1 (enExample) 1972-12-15
JPS56104137U (enExample) 1981-08-14
US3791019A (en) 1974-02-12
NL7204147A (enExample) 1972-11-07
ES402040A1 (es) 1975-03-16
NL164701B (nl) 1980-08-15
DE2122104B2 (de) 1978-01-19
DE2122104C3 (de) 1979-08-23
DE2122104A1 (de) 1972-11-16
GB1388465A (en) 1975-03-26
AU4190572A (en) 1973-12-20
FR2135335B1 (enExample) 1976-08-06
NL164701C (nl) 1981-01-15

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