CH496321A - Halbleiterbauelement mit einer Hülle, zwei Anschlüsse aufweist - Google Patents

Halbleiterbauelement mit einer Hülle, zwei Anschlüsse aufweist

Info

Publication number
CH496321A
CH496321A CH1129069A CH1129069A CH496321A CH 496321 A CH496321 A CH 496321A CH 1129069 A CH1129069 A CH 1129069A CH 1129069 A CH1129069 A CH 1129069A CH 496321 A CH496321 A CH 496321A
Authority
CH
Switzerland
Prior art keywords
connections
shell
semiconductor component
semiconductor
component
Prior art date
Application number
CH1129069A
Other languages
English (en)
Inventor
Gilbert Summers John
Pierre Pont Maurice
Wilde David
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH496321A publication Critical patent/CH496321A/de

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    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Element Separation (AREA)
CH1129069A 1968-07-26 1969-07-23 Halbleiterbauelement mit einer Hülle, zwei Anschlüsse aufweist CH496321A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3587168 1968-07-26

Publications (1)

Publication Number Publication Date
CH496321A true CH496321A (de) 1970-09-15

Family

ID=10382481

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1129069A CH496321A (de) 1968-07-26 1969-07-23 Halbleiterbauelement mit einer Hülle, zwei Anschlüsse aufweist

Country Status (6)

Country Link
BE (1) BE736688A (de)
CH (1) CH496321A (de)
DE (1) DE1937638A1 (de)
FR (1) FR2014747A1 (de)
GB (1) GB1230620A (de)
NL (1) NL6911177A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0041949B1 (de) * 1979-12-18 1987-06-10 CTS Corporation Schaltkreis-bauelement mit einer vertiefung und verfahren zur herstellung
US4649415A (en) * 1985-01-15 1987-03-10 National Semiconductor Corporation Semiconductor package with tape mounted die
GB2195825B (en) * 1986-09-22 1990-01-10 Motorola Inc Integrated circuit package
FR2758417B1 (fr) * 1997-01-16 1999-04-09 Thomson Csf Boitier d'encapsulation de composant hyperfrequence, et procede d'obtention

Also Published As

Publication number Publication date
GB1230620A (de) 1971-05-05
FR2014747A1 (de) 1970-04-17
NL6911177A (de) 1970-01-29
DE1937638A1 (de) 1970-02-05
BE736688A (de) 1970-01-28

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