JPS56101760A - Formation of package of semiconductors - Google Patents
Formation of package of semiconductorsInfo
- Publication number
- JPS56101760A JPS56101760A JP517680A JP517680A JPS56101760A JP S56101760 A JPS56101760 A JP S56101760A JP 517680 A JP517680 A JP 517680A JP 517680 A JP517680 A JP 517680A JP S56101760 A JPS56101760 A JP S56101760A
- Authority
- JP
- Japan
- Prior art keywords
- molds
- lead frame
- integrating
- recess
- planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 230000013011 mating Effects 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP517680A JPS56101760A (en) | 1980-01-18 | 1980-01-18 | Formation of package of semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP517680A JPS56101760A (en) | 1980-01-18 | 1980-01-18 | Formation of package of semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56101760A true JPS56101760A (en) | 1981-08-14 |
| JPS6138862B2 JPS6138862B2 (enrdf_load_stackoverflow) | 1986-09-01 |
Family
ID=11603922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP517680A Granted JPS56101760A (en) | 1980-01-18 | 1980-01-18 | Formation of package of semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56101760A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4680617A (en) * | 1984-05-23 | 1987-07-14 | Ross Milton I | Encapsulated electronic circuit device, and method and apparatus for making same |
| US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
-
1980
- 1980-01-18 JP JP517680A patent/JPS56101760A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4680617A (en) * | 1984-05-23 | 1987-07-14 | Ross Milton I | Encapsulated electronic circuit device, and method and apparatus for making same |
| US4872825A (en) * | 1984-05-23 | 1989-10-10 | Ross Milton I | Method and apparatus for making encapsulated electronic circuit devices |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6138862B2 (enrdf_load_stackoverflow) | 1986-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS55163868A (en) | Lead frame and semiconductor device using the same | |
| ES532883A0 (es) | Procedimiento y dispositivo de fabricacion de cristales sobremoldeados | |
| ES455627A1 (es) | Perfeccionamientos en la fabricacion de piezas inyectadas demateriales plasticos de estructura compuesta. | |
| JPS56101760A (en) | Formation of package of semiconductors | |
| JPS5738579A (en) | Connector unit | |
| JPS552034A (en) | Method and appratus for fusing upper and lower leg portion of thermoplastic synthetic resin fastener element | |
| JPS5664445A (en) | Manufacture of semiconductor device | |
| GB932030A (en) | Improvements in or relating to the production of fluid-tight seals | |
| JPS57117935A (en) | Molding structure for synthetic resin molding | |
| JPS6136940A (ja) | 半導体樹脂封止装置 | |
| JPS5629338A (en) | Resin sealing of semiconductor element | |
| KR900004231Y1 (ko) | 몰드 금형의 성형품 공기 주입구 밀폐장치 | |
| JPS6444026A (en) | Resin-seal formation of component to be sealed and heat resistant sheet member used therefor | |
| JPS638130Y2 (enrdf_load_stackoverflow) | ||
| JPS5633847A (en) | Package molding for semiconductor | |
| JPS6473747A (en) | Formation of plastic package of semiconductor or the like | |
| JPS6144646B2 (enrdf_load_stackoverflow) | ||
| JPS5664446A (en) | Method of molding synthetic resin insert for metal terminal, metal terminal and mold | |
| JPS5617238A (en) | Mold device for molding resin | |
| JPS55148142A (en) | Molded piece | |
| KR800001504Y1 (ko) | 전해콘덴서용 고무패킹의 성형장치 | |
| JPS5759735A (en) | Method of molding article | |
| JPS5569421A (en) | Modling of frame for electric appliance | |
| JPS6450454A (en) | Manufacture of lead frame and semiconductor device | |
| JPS57137130A (en) | Method for resin sealing |