JPS5599752A - Structure for fitting ic chip - Google Patents

Structure for fitting ic chip

Info

Publication number
JPS5599752A
JPS5599752A JP796879A JP796879A JPS5599752A JP S5599752 A JPS5599752 A JP S5599752A JP 796879 A JP796879 A JP 796879A JP 796879 A JP796879 A JP 796879A JP S5599752 A JPS5599752 A JP S5599752A
Authority
JP
Japan
Prior art keywords
chip
hollow
adhesive
substrate
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP796879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6118864B2 (enrdf_load_stackoverflow
Inventor
Toshihiko Tsuge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP796879A priority Critical patent/JPS5599752A/ja
Publication of JPS5599752A publication Critical patent/JPS5599752A/ja
Publication of JPS6118864B2 publication Critical patent/JPS6118864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP796879A 1979-01-25 1979-01-25 Structure for fitting ic chip Granted JPS5599752A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP796879A JPS5599752A (en) 1979-01-25 1979-01-25 Structure for fitting ic chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP796879A JPS5599752A (en) 1979-01-25 1979-01-25 Structure for fitting ic chip

Publications (2)

Publication Number Publication Date
JPS5599752A true JPS5599752A (en) 1980-07-30
JPS6118864B2 JPS6118864B2 (enrdf_load_stackoverflow) 1986-05-14

Family

ID=11680254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP796879A Granted JPS5599752A (en) 1979-01-25 1979-01-25 Structure for fitting ic chip

Country Status (1)

Country Link
JP (1) JPS5599752A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165659A (en) * 1979-06-11 1980-12-24 Fujitsu Ltd Semiconductor device
JP2005303245A (ja) * 2004-03-19 2005-10-27 Sony Computer Entertainment Inc 回路の発熱制御方法、装置およびシステム
JP2008510301A (ja) * 2004-08-13 2008-04-03 インテル・コーポレーション 集積回路装置のための液体金属熱インターフェース

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63317400A (ja) * 1987-06-19 1988-12-26 尾池工業株式会社 転写シ−ト

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55165659A (en) * 1979-06-11 1980-12-24 Fujitsu Ltd Semiconductor device
JP2005303245A (ja) * 2004-03-19 2005-10-27 Sony Computer Entertainment Inc 回路の発熱制御方法、装置およびシステム
JP2008510301A (ja) * 2004-08-13 2008-04-03 インテル・コーポレーション 集積回路装置のための液体金属熱インターフェース

Also Published As

Publication number Publication date
JPS6118864B2 (enrdf_load_stackoverflow) 1986-05-14

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