JPS5598243A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5598243A
JPS5598243A JP474779A JP474779A JPS5598243A JP S5598243 A JPS5598243 A JP S5598243A JP 474779 A JP474779 A JP 474779A JP 474779 A JP474779 A JP 474779A JP S5598243 A JPS5598243 A JP S5598243A
Authority
JP
Japan
Prior art keywords
polybutadiene
resin
molecule
epoxy resin
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP474779A
Other languages
Japanese (ja)
Inventor
Kazumasa Saito
Isao Watanabe
Norio Saruwatari
Katsura Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP474779A priority Critical patent/JPS5598243A/en
Publication of JPS5598243A publication Critical patent/JPS5598243A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE: To provide a title composition having an excellent dielectric properties and useful as electric insulating material by using composition of (modified) 1,2- polybutadiene resin having at least 50% of 1, 2-bond units in a molecule, epoxy resin having two or more of glycidyl gp. in a molecule, and curing agent.
CONSTITUTION: (a) 100pts.wt. of 1, 2-polybutadiene resin having at least 50% of 1, 2-bond units in a molecule, or modified 1, 2-polybutadiene resin formed by modifying part of 1, 2-bond with epoxy gp., hydroxyl gp. or carboxylic gp., such as epoxidized 1, 2-polybutadiene, hydroxylated 1, 2-polybutadiene, or carboxylated 1, 2-polybutadiene is mixed with (b) 10W100pts.wt. of epoxy resin such as bisphenolic epoxide that contains two or more of glycydil gp. in a molecule. To the mixture, (c) respective hardners for polybutadiene and epoxy resin are added, heated, and cured to provide the object cured resin.
COPYRIGHT: (C)1980,JPO&Japio
JP474779A 1979-01-22 1979-01-22 Thermosetting resin composition Pending JPS5598243A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP474779A JPS5598243A (en) 1979-01-22 1979-01-22 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP474779A JPS5598243A (en) 1979-01-22 1979-01-22 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5598243A true JPS5598243A (en) 1980-07-26

Family

ID=11592500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP474779A Pending JPS5598243A (en) 1979-01-22 1979-01-22 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5598243A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011240A1 (en) * 1994-10-11 1996-04-18 Shell Internationale Research Maatschappij B.V. Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996011240A1 (en) * 1994-10-11 1996-04-18 Shell Internationale Research Maatschappij B.V. Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems
US5910541A (en) * 1994-10-11 1999-06-08 Shell Oil Company Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems

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