JPS5598243A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5598243A JPS5598243A JP474779A JP474779A JPS5598243A JP S5598243 A JPS5598243 A JP S5598243A JP 474779 A JP474779 A JP 474779A JP 474779 A JP474779 A JP 474779A JP S5598243 A JPS5598243 A JP S5598243A
- Authority
- JP
- Japan
- Prior art keywords
- polybutadiene
- resin
- molecule
- epoxy resin
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: To provide a title composition having an excellent dielectric properties and useful as electric insulating material by using composition of (modified) 1,2- polybutadiene resin having at least 50% of 1, 2-bond units in a molecule, epoxy resin having two or more of glycidyl gp. in a molecule, and curing agent.
CONSTITUTION: (a) 100pts.wt. of 1, 2-polybutadiene resin having at least 50% of 1, 2-bond units in a molecule, or modified 1, 2-polybutadiene resin formed by modifying part of 1, 2-bond with epoxy gp., hydroxyl gp. or carboxylic gp., such as epoxidized 1, 2-polybutadiene, hydroxylated 1, 2-polybutadiene, or carboxylated 1, 2-polybutadiene is mixed with (b) 10W100pts.wt. of epoxy resin such as bisphenolic epoxide that contains two or more of glycydil gp. in a molecule. To the mixture, (c) respective hardners for polybutadiene and epoxy resin are added, heated, and cured to provide the object cured resin.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP474779A JPS5598243A (en) | 1979-01-22 | 1979-01-22 | Thermosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP474779A JPS5598243A (en) | 1979-01-22 | 1979-01-22 | Thermosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5598243A true JPS5598243A (en) | 1980-07-26 |
Family
ID=11592500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP474779A Pending JPS5598243A (en) | 1979-01-22 | 1979-01-22 | Thermosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5598243A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996011240A1 (en) * | 1994-10-11 | 1996-04-18 | Shell Internationale Research Maatschappij B.V. | Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
-
1979
- 1979-01-22 JP JP474779A patent/JPS5598243A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996011240A1 (en) * | 1994-10-11 | 1996-04-18 | Shell Internationale Research Maatschappij B.V. | Pressure sensitive structural adhesives and sealants based on telechelic/heterotelechelic polymers with dual cure systems |
US5910541A (en) * | 1994-10-11 | 1999-06-08 | Shell Oil Company | Telechelic polymers and heterotelechelic polydiene block polymers with dual cure systems |
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