JPS5589471A - Target for sputtering - Google Patents

Target for sputtering

Info

Publication number
JPS5589471A
JPS5589471A JP16472478A JP16472478A JPS5589471A JP S5589471 A JPS5589471 A JP S5589471A JP 16472478 A JP16472478 A JP 16472478A JP 16472478 A JP16472478 A JP 16472478A JP S5589471 A JPS5589471 A JP S5589471A
Authority
JP
Japan
Prior art keywords
target
fixed
sputtering
ceramic
aid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16472478A
Other languages
English (en)
Other versions
JPS6014833B2 (ja
Inventor
Koji Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP16472478A priority Critical patent/JPS6014833B2/ja
Publication of JPS5589471A publication Critical patent/JPS5589471A/ja
Publication of JPS6014833B2 publication Critical patent/JPS6014833B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP16472478A 1978-12-26 1978-12-26 スパツタリング用タ−ゲツト Expired JPS6014833B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16472478A JPS6014833B2 (ja) 1978-12-26 1978-12-26 スパツタリング用タ−ゲツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16472478A JPS6014833B2 (ja) 1978-12-26 1978-12-26 スパツタリング用タ−ゲツト

Publications (2)

Publication Number Publication Date
JPS5589471A true JPS5589471A (en) 1980-07-07
JPS6014833B2 JPS6014833B2 (ja) 1985-04-16

Family

ID=15798680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16472478A Expired JPS6014833B2 (ja) 1978-12-26 1978-12-26 スパツタリング用タ−ゲツト

Country Status (1)

Country Link
JP (1) JPS6014833B2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141767A (ja) * 1984-05-17 1986-02-28 バリアン・アソシエイツ・インコ−ポレイテツド 別個の放電にさらされるターゲットへの別個の閉込め磁界を有するマグネトロンスパッタリング装置を制御する装置および方法
JPH04231462A (ja) * 1990-06-29 1992-08-20 Leybold Ag 陰極スパッタリング装置
JPH06108240A (ja) * 1992-09-30 1994-04-19 Shibaura Eng Works Co Ltd スパッタリング源
WO1996025532A1 (en) * 1995-02-17 1996-08-22 Materials Research Corporation Mechanically joined sputtering target and adapter therefor
CN112063977A (zh) * 2020-09-18 2020-12-11 长沙神弧离子镀膜有限公司 高钪铝钪合金靶及其靶材绑定方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141767A (ja) * 1984-05-17 1986-02-28 バリアン・アソシエイツ・インコ−ポレイテツド 別個の放電にさらされるターゲットへの別個の閉込め磁界を有するマグネトロンスパッタリング装置を制御する装置および方法
JPH04231462A (ja) * 1990-06-29 1992-08-20 Leybold Ag 陰極スパッタリング装置
JPH06108240A (ja) * 1992-09-30 1994-04-19 Shibaura Eng Works Co Ltd スパッタリング源
WO1996025532A1 (en) * 1995-02-17 1996-08-22 Materials Research Corporation Mechanically joined sputtering target and adapter therefor
CN112063977A (zh) * 2020-09-18 2020-12-11 长沙神弧离子镀膜有限公司 高钪铝钪合金靶及其靶材绑定方法

Also Published As

Publication number Publication date
JPS6014833B2 (ja) 1985-04-16

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