JPS5586124A - Assembly method for semiconductor device - Google Patents
Assembly method for semiconductor deviceInfo
- Publication number
- JPS5586124A JPS5586124A JP15854878A JP15854878A JPS5586124A JP S5586124 A JPS5586124 A JP S5586124A JP 15854878 A JP15854878 A JP 15854878A JP 15854878 A JP15854878 A JP 15854878A JP S5586124 A JPS5586124 A JP S5586124A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- size
- reliability
- production line
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000008188 pellet Substances 0.000 abstract 2
- 101100008048 Caenorhabditis elegans cut-4 gene Proteins 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000011109 contamination Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 238000003860 storage Methods 0.000 abstract 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15854878A JPS5586124A (en) | 1978-12-25 | 1978-12-25 | Assembly method for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15854878A JPS5586124A (en) | 1978-12-25 | 1978-12-25 | Assembly method for semiconductor device |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13715284A Division JPS6063937A (ja) | 1984-07-04 | 1984-07-04 | 電子部品の組立装置 |
| JP59137151A Division JPS6063936A (ja) | 1984-07-04 | 1984-07-04 | リ−ドフレ−ムの処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5586124A true JPS5586124A (en) | 1980-06-28 |
| JPS63947B2 JPS63947B2 (enrdf_load_stackoverflow) | 1988-01-09 |
Family
ID=15674106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15854878A Granted JPS5586124A (en) | 1978-12-25 | 1978-12-25 | Assembly method for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5586124A (enrdf_load_stackoverflow) |
-
1978
- 1978-12-25 JP JP15854878A patent/JPS5586124A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63947B2 (enrdf_load_stackoverflow) | 1988-01-09 |
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