JPS5769006A - Method of continuously molding small resin parts - Google Patents

Method of continuously molding small resin parts

Info

Publication number
JPS5769006A
JPS5769006A JP14497780A JP14497780A JPS5769006A JP S5769006 A JPS5769006 A JP S5769006A JP 14497780 A JP14497780 A JP 14497780A JP 14497780 A JP14497780 A JP 14497780A JP S5769006 A JPS5769006 A JP S5769006A
Authority
JP
Japan
Prior art keywords
dummy lines
molding dies
parts
resin
resin parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14497780A
Other languages
Japanese (ja)
Other versions
JPS6015450B2 (en
Inventor
Kazuhiro Mori
Tokuhito Hamane
Shigeru Namiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14497780A priority Critical patent/JPS6015450B2/en
Publication of JPS5769006A publication Critical patent/JPS5769006A/en
Publication of JPS6015450B2 publication Critical patent/JPS6015450B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To obtain the captioned parts at a low cost efficiently in view of the mass production, by feeding dummy lines into resin molding dies, molding integrally the resin with the dummy lines in the molding dies, and subsequently conveying the molded parts through the dummy lines.
CONSTITUTION: The dummy lines 2 are payed out from the recoiler 4 into the resin molding dies 5. Then the melted resin is charged in the molding dies 5, and the small part 1 and the dummy lines 2, 2' are cooled together to be integrally molded. As the dummy lines 2, 2 are taken equally intermittently onto an uncoiler 6, the small parts 1 integrally molded with dummy lines 2 with the same pitch P between the small parts 1 can be taken out, and are wound onto the recoiler 6.
COPYRIGHT: (C)1982,JPO&Japio
JP14497780A 1980-10-15 1980-10-15 Continuous molding method for small resin parts Expired JPS6015450B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14497780A JPS6015450B2 (en) 1980-10-15 1980-10-15 Continuous molding method for small resin parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14497780A JPS6015450B2 (en) 1980-10-15 1980-10-15 Continuous molding method for small resin parts

Publications (2)

Publication Number Publication Date
JPS5769006A true JPS5769006A (en) 1982-04-27
JPS6015450B2 JPS6015450B2 (en) 1985-04-19

Family

ID=15374598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14497780A Expired JPS6015450B2 (en) 1980-10-15 1980-10-15 Continuous molding method for small resin parts

Country Status (1)

Country Link
JP (1) JPS6015450B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204245A (en) * 1983-05-06 1984-11-19 Mitsubishi Electric Corp Resin sealing process of semicondutor device
JPS6361775B2 (en) * 1983-05-06 1988-11-30

Also Published As

Publication number Publication date
JPS6015450B2 (en) 1985-04-19

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