JPS5769006A - Method of continuously molding small resin parts - Google Patents
Method of continuously molding small resin partsInfo
- Publication number
- JPS5769006A JPS5769006A JP14497780A JP14497780A JPS5769006A JP S5769006 A JPS5769006 A JP S5769006A JP 14497780 A JP14497780 A JP 14497780A JP 14497780 A JP14497780 A JP 14497780A JP S5769006 A JPS5769006 A JP S5769006A
- Authority
- JP
- Japan
- Prior art keywords
- dummy lines
- molding dies
- parts
- resin
- resin parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To obtain the captioned parts at a low cost efficiently in view of the mass production, by feeding dummy lines into resin molding dies, molding integrally the resin with the dummy lines in the molding dies, and subsequently conveying the molded parts through the dummy lines.
CONSTITUTION: The dummy lines 2 are payed out from the recoiler 4 into the resin molding dies 5. Then the melted resin is charged in the molding dies 5, and the small part 1 and the dummy lines 2, 2' are cooled together to be integrally molded. As the dummy lines 2, 2 are taken equally intermittently onto an uncoiler 6, the small parts 1 integrally molded with dummy lines 2 with the same pitch P between the small parts 1 can be taken out, and are wound onto the recoiler 6.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14497780A JPS6015450B2 (en) | 1980-10-15 | 1980-10-15 | Continuous molding method for small resin parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14497780A JPS6015450B2 (en) | 1980-10-15 | 1980-10-15 | Continuous molding method for small resin parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5769006A true JPS5769006A (en) | 1982-04-27 |
JPS6015450B2 JPS6015450B2 (en) | 1985-04-19 |
Family
ID=15374598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14497780A Expired JPS6015450B2 (en) | 1980-10-15 | 1980-10-15 | Continuous molding method for small resin parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6015450B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59204245A (en) * | 1983-05-06 | 1984-11-19 | Mitsubishi Electric Corp | Resin sealing process of semicondutor device |
-
1980
- 1980-10-15 JP JP14497780A patent/JPS6015450B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59204245A (en) * | 1983-05-06 | 1984-11-19 | Mitsubishi Electric Corp | Resin sealing process of semicondutor device |
JPS6361775B2 (en) * | 1983-05-06 | 1988-11-30 |
Also Published As
Publication number | Publication date |
---|---|
JPS6015450B2 (en) | 1985-04-19 |
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