JPS5578529A - Coating device for semiconductor substrate - Google Patents

Coating device for semiconductor substrate

Info

Publication number
JPS5578529A
JPS5578529A JP15196878A JP15196878A JPS5578529A JP S5578529 A JPS5578529 A JP S5578529A JP 15196878 A JP15196878 A JP 15196878A JP 15196878 A JP15196878 A JP 15196878A JP S5578529 A JPS5578529 A JP S5578529A
Authority
JP
Japan
Prior art keywords
coating liquid
semiconductor substrate
solenoid valve
feed
coating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15196878A
Other languages
Japanese (ja)
Inventor
Mitsuo Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15196878A priority Critical patent/JPS5578529A/en
Publication of JPS5578529A publication Critical patent/JPS5578529A/en
Pending legal-status Critical Current

Links

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE: To reform a coating liquid feed unit and also to automate a device by preventing undesired coating liquid from dripping through nozzle after injection.
CONSTITUTION: A high pressure source 11 to feed a coating liquid is connected to an airtight vessel 12 containing the coating liquid 14 through a conduit 13. A nozzle 15 is then opposed to a semiconductor substrate 7 to coat and connected to the vessel 12 through feed liquid conduit 23. And the first solenoid valve 16, the second solenoid valve 26 and a diaphragm type solenoid valve 36 are provided halfway on the conduits 13, 23, which are controlled by a controller.
COPYRIGHT: (C)1980,JPO&Japio
JP15196878A 1978-12-11 1978-12-11 Coating device for semiconductor substrate Pending JPS5578529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15196878A JPS5578529A (en) 1978-12-11 1978-12-11 Coating device for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15196878A JPS5578529A (en) 1978-12-11 1978-12-11 Coating device for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5578529A true JPS5578529A (en) 1980-06-13

Family

ID=15530144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15196878A Pending JPS5578529A (en) 1978-12-11 1978-12-11 Coating device for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5578529A (en)

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