JPS5568646A - Clamper for ultrasonic bonding - Google Patents

Clamper for ultrasonic bonding

Info

Publication number
JPS5568646A
JPS5568646A JP14239078A JP14239078A JPS5568646A JP S5568646 A JPS5568646 A JP S5568646A JP 14239078 A JP14239078 A JP 14239078A JP 14239078 A JP14239078 A JP 14239078A JP S5568646 A JPS5568646 A JP S5568646A
Authority
JP
Japan
Prior art keywords
lead member
carrier
hold
claw
down claw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14239078A
Other languages
Japanese (ja)
Inventor
Yoshio Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14239078A priority Critical patent/JPS5568646A/en
Publication of JPS5568646A publication Critical patent/JPS5568646A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To perform sure bonding, by clamping the bonded part of a lead member by a hold-down claw and a lead member carrier of rough surface.
CONSTITUTION: A saw-toothed face 12 is provided on the top of a lead member carrier 10. The bottom of the carrier 10 is cut off by a thickness equal to the total thickness of a header 4 and a pellet 6. A hold-down claw 11 is sharp-pointed depending on the form of the lead member carrier 10. The header 4 is pushed in under the carrier 10 by a frame thrust-in claw 13. The bonded part of a lead member is firmly clamped by the hold-down claw and the saw-toothed face of the lead member carrier. The hold-down claw and the teeth of the carrier gnaw into the lead member to firmly fix the tip of the lead member. An ultrasonic bonding tool 14 is then moved down onto the lead member. The lead member is effectively bonded because vibration energy does not escape.
COPYRIGHT: (C)1980,JPO&Japio
JP14239078A 1978-11-20 1978-11-20 Clamper for ultrasonic bonding Pending JPS5568646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14239078A JPS5568646A (en) 1978-11-20 1978-11-20 Clamper for ultrasonic bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14239078A JPS5568646A (en) 1978-11-20 1978-11-20 Clamper for ultrasonic bonding

Publications (1)

Publication Number Publication Date
JPS5568646A true JPS5568646A (en) 1980-05-23

Family

ID=15314240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14239078A Pending JPS5568646A (en) 1978-11-20 1978-11-20 Clamper for ultrasonic bonding

Country Status (1)

Country Link
JP (1) JPS5568646A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017069584A (en) * 2017-01-10 2017-04-06 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017069584A (en) * 2017-01-10 2017-04-06 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method of the same

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