JPS5565482A - Optical semiconductor device - Google Patents
Optical semiconductor deviceInfo
- Publication number
- JPS5565482A JPS5565482A JP13784678A JP13784678A JPS5565482A JP S5565482 A JPS5565482 A JP S5565482A JP 13784678 A JP13784678 A JP 13784678A JP 13784678 A JP13784678 A JP 13784678A JP S5565482 A JPS5565482 A JP S5565482A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- layer
- light diffusing
- coating
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
PURPOSE: To improve transmission factor and thus to obtain a better luminous efficiency on LED chip by coating one principal surface of a thick substrate layer used for filter plate thinly with a mixture of light diffusing pigment and adhesive.
CONSTITUTION: A thick substrate layer 61 is used to rigidify a filter plate 6, a light diffusing adhesive layer 62 obtained through coating one principal surface of the layer 61 thinly with a mixture of light diffusing pigment and adhesive is provided, and a transparent surface protecting layer 64 is provided on the other surface with an adhesive 63. Then, a reflection member 4 having a base 2, a wiring pattern 3 and a reflection face 4a surrounding LED1, LED1 arranged on the pattern 3 is provided on the other part. Transmission factor is improved thereby to obtain a better luminous efficiency on LED chip.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13784678A JPS5565482A (en) | 1978-11-10 | 1978-11-10 | Optical semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13784678A JPS5565482A (en) | 1978-11-10 | 1978-11-10 | Optical semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5565482A true JPS5565482A (en) | 1980-05-16 |
Family
ID=15208172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13784678A Pending JPS5565482A (en) | 1978-11-10 | 1978-11-10 | Optical semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5565482A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014209198A (en) * | 2013-03-27 | 2014-11-06 | ソニー株式会社 | Display unit |
-
1978
- 1978-11-10 JP JP13784678A patent/JPS5565482A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014209198A (en) * | 2013-03-27 | 2014-11-06 | ソニー株式会社 | Display unit |
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