JPS5565482A - Optical semiconductor device - Google Patents

Optical semiconductor device

Info

Publication number
JPS5565482A
JPS5565482A JP13784678A JP13784678A JPS5565482A JP S5565482 A JPS5565482 A JP S5565482A JP 13784678 A JP13784678 A JP 13784678A JP 13784678 A JP13784678 A JP 13784678A JP S5565482 A JPS5565482 A JP S5565482A
Authority
JP
Japan
Prior art keywords
adhesive
layer
light diffusing
coating
mixture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13784678A
Other languages
Japanese (ja)
Inventor
Shinjiro Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13784678A priority Critical patent/JPS5565482A/en
Publication of JPS5565482A publication Critical patent/JPS5565482A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE: To improve transmission factor and thus to obtain a better luminous efficiency on LED chip by coating one principal surface of a thick substrate layer used for filter plate thinly with a mixture of light diffusing pigment and adhesive.
CONSTITUTION: A thick substrate layer 61 is used to rigidify a filter plate 6, a light diffusing adhesive layer 62 obtained through coating one principal surface of the layer 61 thinly with a mixture of light diffusing pigment and adhesive is provided, and a transparent surface protecting layer 64 is provided on the other surface with an adhesive 63. Then, a reflection member 4 having a base 2, a wiring pattern 3 and a reflection face 4a surrounding LED1, LED1 arranged on the pattern 3 is provided on the other part. Transmission factor is improved thereby to obtain a better luminous efficiency on LED chip.
COPYRIGHT: (C)1980,JPO&Japio
JP13784678A 1978-11-10 1978-11-10 Optical semiconductor device Pending JPS5565482A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13784678A JPS5565482A (en) 1978-11-10 1978-11-10 Optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13784678A JPS5565482A (en) 1978-11-10 1978-11-10 Optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS5565482A true JPS5565482A (en) 1980-05-16

Family

ID=15208172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13784678A Pending JPS5565482A (en) 1978-11-10 1978-11-10 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS5565482A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014209198A (en) * 2013-03-27 2014-11-06 ソニー株式会社 Display unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014209198A (en) * 2013-03-27 2014-11-06 ソニー株式会社 Display unit

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