JPS5550399B1 - - Google Patents

Info

Publication number
JPS5550399B1
JPS5550399B1 JP12460570A JP12460570A JPS5550399B1 JP S5550399 B1 JPS5550399 B1 JP S5550399B1 JP 12460570 A JP12460570 A JP 12460570A JP 12460570 A JP12460570 A JP 12460570A JP S5550399 B1 JPS5550399 B1 JP S5550399B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12460570A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5550399B1 publication Critical patent/JPS5550399B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP12460570A 1970-03-05 1970-12-29 Pending JPS5550399B1 (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1674270A 1970-03-05 1970-03-05

Publications (1)

Publication Number Publication Date
JPS5550399B1 true JPS5550399B1 (nl) 1980-12-17

Family

ID=21778714

Family Applications (2)

Application Number Title Priority Date Filing Date
JP12460570A Pending JPS5550399B1 (nl) 1970-03-05 1970-12-29
JP549673A Pending JPS5710592B1 (nl) 1970-03-05 1973-01-09

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP549673A Pending JPS5710592B1 (nl) 1970-03-05 1973-01-09

Country Status (7)

Country Link
JP (2) JPS5550399B1 (nl)
AT (1) AT312731B (nl)
CA (1) CA932478A (nl)
DE (1) DE2111396B2 (nl)
FR (1) FR2084258A5 (nl)
GB (1) GB1352557A (nl)
NL (1) NL173907C (nl)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174419A (ja) * 1998-12-03 2000-06-23 Hitachi Chem Co Ltd 布線装置とそれを用いた配線板の製造方法

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2185915B1 (nl) * 1972-05-25 1975-08-29 Commissariat Energie Atomique
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques
US4065850A (en) * 1975-08-13 1978-01-03 Kollmorgen Technologies Corporation Method of making multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
ZA781637B (en) * 1977-06-20 1979-02-28 Kollmorgen Tech Corp Wire scribed circuit board and method for the manufacture thereof
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
FR2424646A1 (fr) * 1978-04-28 1979-11-23 Commissariat Energie Atomique Procede de raccordement de bornes de connexion d'ensembles electriques
FR2458978A2 (fr) * 1979-06-07 1981-01-02 Commissariat Energie Atomique Procede et dispositif d'interconnexions de composants electronique
DE3035090C2 (de) * 1979-09-28 1995-01-26 Cii Honeywell Bull Vorrichtung zur Verdrahtung von Substratoberflächen
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507853A1 (fr) * 1981-06-12 1982-12-17 Brefdent Dominique Procede d'interconnexion de composants par insertion a force d'un fil metallique
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
EP0168602A1 (en) * 1984-06-25 1986-01-22 Kollmorgen Technologies Corporation Method for making interconnection circuit boards
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
JPS6292495A (ja) * 1985-09-13 1987-04-27 アドバンスト　インターコネクション　テクノロジー　インコーポレイテッド 電子部品を相互接続するための基板の製造法およびそれによつて製造される物品
DE3539040A1 (de) * 1985-11-04 1987-05-07 Telefonbau & Normalzeit Gmbh Leiterbahnanordnung und schaltungsanordnung fuer mit integrierten schaltkreisen bestueckte leiterplatten
US4972050A (en) * 1989-06-30 1990-11-20 Kollmorgen Corporation Wire scribed circuit boards and methods of their manufacture
US6137054A (en) * 1994-01-25 2000-10-24 Yazaki Corporation Wire-circuit sheet and electric junction box thereof
DE19705934C2 (de) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Einbringen von drahtförmigen Leiterdrähten in ein Substrat
US8646675B2 (en) 2004-11-02 2014-02-11 Hid Global Gmbh Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
IL184260A0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
ES2355682T3 (es) 2007-09-18 2011-03-30 Hid Global Ireland Teoranta Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato.
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
GB2502600B8 (en) 2012-05-31 2015-01-07 Improvements in touch sensitive displays
GB2502602B (en) * 2012-05-31 2015-06-03 Zytronic Displays Ltd Multi-touch sensing panel production method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2958018A (en) * 1955-11-07 1960-10-25 Donald O Kocmich Capacitance operated electronic control
US3234629A (en) * 1962-06-14 1966-02-15 Defiance Printed Circuit Corp Method for producing printed circuits
US3377698A (en) * 1964-09-21 1968-04-16 Gen Motors Corp Method of making an electrical circuit
DE1906267A1 (de) * 1968-02-07 1969-11-13 Poclain Sa Hydraulische Steuerungseinrichtung,insbesondere fuer die Steuerung von hydraulischen Winden

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000174419A (ja) * 1998-12-03 2000-06-23 Hitachi Chem Co Ltd 布線装置とそれを用いた配線板の製造方法

Also Published As

Publication number Publication date
DE2111396A1 (de) 1971-09-30
AT312731B (de) 1974-01-10
NL173907B (nl) 1983-10-17
FR2084258A5 (nl) 1971-12-17
NL173907C (nl) 1984-03-16
DE2111396B2 (de) 1976-04-29
NL7103009A (nl) 1971-09-07
CA932478A (en) 1973-08-21
GB1352557A (en) 1974-05-08
JPS5710592B1 (nl) 1982-02-26

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