JPS5543080B2 - - Google Patents

Info

Publication number
JPS5543080B2
JPS5543080B2 JP10108275A JP10108275A JPS5543080B2 JP S5543080 B2 JPS5543080 B2 JP S5543080B2 JP 10108275 A JP10108275 A JP 10108275A JP 10108275 A JP10108275 A JP 10108275A JP S5543080 B2 JPS5543080 B2 JP S5543080B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10108275A
Other languages
Japanese (ja)
Other versions
JPS5147540A (US07608600-20091027-C00054.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5147540A publication Critical patent/JPS5147540A/ja
Publication of JPS5543080B2 publication Critical patent/JPS5543080B2/ja
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP10108275A 1974-09-20 1975-08-20 Expired JPS5543080B2 (US07608600-20091027-C00054.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2445538A DE2445538C2 (de) 1974-09-20 1974-09-20 Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Edelmetall - Legierungen

Publications (2)

Publication Number Publication Date
JPS5147540A JPS5147540A (US07608600-20091027-C00054.png) 1976-04-23
JPS5543080B2 true JPS5543080B2 (US07608600-20091027-C00054.png) 1980-11-04

Family

ID=5926581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10108275A Expired JPS5543080B2 (US07608600-20091027-C00054.png) 1974-09-20 1975-08-20

Country Status (20)

Country Link
US (1) US3980531A (US07608600-20091027-C00054.png)
JP (1) JPS5543080B2 (US07608600-20091027-C00054.png)
AR (2) AR207378A1 (US07608600-20091027-C00054.png)
AT (1) AT335814B (US07608600-20091027-C00054.png)
BR (1) BR7504794A (US07608600-20091027-C00054.png)
CA (1) CA1066651A (US07608600-20091027-C00054.png)
CH (1) CH615228A5 (US07608600-20091027-C00054.png)
CS (1) CS181785B2 (US07608600-20091027-C00054.png)
DD (1) DD118125A5 (US07608600-20091027-C00054.png)
DE (1) DE2445538C2 (US07608600-20091027-C00054.png)
ES (1) ES438408A1 (US07608600-20091027-C00054.png)
FR (1) FR2285474A1 (US07608600-20091027-C00054.png)
GB (1) GB1526216A (US07608600-20091027-C00054.png)
HU (1) HU173533B (US07608600-20091027-C00054.png)
IE (1) IE41858B1 (US07608600-20091027-C00054.png)
IT (1) IT1042700B (US07608600-20091027-C00054.png)
NL (1) NL7511061A (US07608600-20091027-C00054.png)
SE (1) SE408437B (US07608600-20091027-C00054.png)
YU (1) YU36198B (US07608600-20091027-C00054.png)
ZA (1) ZA755979B (US07608600-20091027-C00054.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067746Y2 (ja) * 1987-03-20 1994-03-02 株式会社タカラ ぬいぐるみ玩具

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4067784A (en) * 1976-06-09 1978-01-10 Oxy Metal Industries Corporation Non-cyanide acidic silver electroplating bath and additive therefore
US4067783A (en) * 1977-03-21 1978-01-10 Bell Telephone Laboratories, Incorporated Gold electroplating process
AU5711280A (en) * 1979-04-24 1980-10-30 Engelhard Industries Ltd. Electrodeposition of a pink gold alloy
AU5711380A (en) * 1979-04-24 1980-10-30 Engelhard Industries Ltd. Electrodeposition of white gold alloy
US4297177A (en) * 1980-09-19 1981-10-27 American Chemical & Refining Company Incorporated Method and composition for electrodepositing palladium/nickel alloys
US4435258A (en) 1982-09-28 1984-03-06 Western Electric Co., Inc. Method and apparatus for the recovery of palladium from spent electroless catalytic baths
US4435253A (en) 1983-01-28 1984-03-06 Omi International Corporation Gold sulphite electroplating solutions and methods
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
JP3985220B2 (ja) * 2001-12-06 2007-10-03 石原薬品株式会社 非シアン系の金−スズ合金メッキ浴
US8389434B2 (en) * 2002-04-11 2013-03-05 Second Sight Medical Products, Inc. Catalyst and a method for manufacturing the same
US6805786B2 (en) * 2002-09-24 2004-10-19 Northrop Grumman Corporation Precious alloyed metal solder plating process
JP5312842B2 (ja) * 2008-05-22 2013-10-09 関東化学株式会社 電解合金めっき液及びそれを用いるめっき方法
JP5025815B1 (ja) * 2011-08-10 2012-09-12 小島化学薬品株式会社 硬質金めっき液
JP6444784B2 (ja) * 2015-03-19 2018-12-26 Jx金属株式会社 銀、チオ硫酸及び不純物を含む溶液の処理方法、チオ硫酸塩の回収方法及び銀の浸出方法
PL3159435T3 (pl) 2015-10-21 2018-10-31 Umicore Galvanotechnik Gmbh Dodatek do elektrolitów do stopu srebro-palladowego
CN106283141A (zh) * 2016-08-11 2017-01-04 江捷新 珠宝首饰玫瑰金色表面处理镀液、制备方法及其电镀方法
CN108786787B (zh) * 2018-05-10 2021-01-05 昆明理工大学 铜掺杂碳量子点/钨酸铋复合光催化剂的制备方法及应用
CN110699713A (zh) * 2019-11-21 2020-01-17 长春黄金研究院有限公司 一种无氰金合金电铸液及其使用方法
JP7213842B2 (ja) * 2020-04-21 2023-01-27 Eeja株式会社 シアン系電解粗化銀めっき液

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50101081A (US07608600-20091027-C00054.png) * 1973-12-28 1975-08-11

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3787463A (en) * 1972-02-24 1974-01-22 Oxy Metal Finishing Corp Amine gold complex useful for the electrodeposition of gold and its alloys

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50101081A (US07608600-20091027-C00054.png) * 1973-12-28 1975-08-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH067746Y2 (ja) * 1987-03-20 1994-03-02 株式会社タカラ ぬいぐるみ玩具

Also Published As

Publication number Publication date
AR207378A1 (es) 1976-09-30
SE408437B (sv) 1979-06-11
CS181785B2 (en) 1978-03-31
SE7510456L (sv) 1976-03-22
DD118125A5 (US07608600-20091027-C00054.png) 1976-02-12
JPS5147540A (US07608600-20091027-C00054.png) 1976-04-23
DE2445538C2 (de) 1984-05-30
DE2445538A1 (de) 1976-04-08
IE41858L (en) 1976-03-20
AU8481975A (en) 1977-03-24
ATA722675A (de) 1976-07-15
FR2285474B1 (US07608600-20091027-C00054.png) 1979-04-06
FR2285474A1 (fr) 1976-04-16
GB1526216A (en) 1978-09-27
AR210493A1 (es) 1977-08-15
ZA755979B (en) 1976-08-25
IT1042700B (it) 1980-01-30
YU106275A (en) 1981-06-30
US3980531A (en) 1976-09-14
NL7511061A (nl) 1976-03-23
ES438408A1 (es) 1977-02-01
YU36198B (en) 1982-02-25
BR7504794A (pt) 1976-08-03
AT335814B (de) 1977-04-12
IE41858B1 (en) 1980-04-09
HU173533B (hu) 1979-06-28
CA1066651A (en) 1979-11-20
CH615228A5 (US07608600-20091027-C00054.png) 1980-01-15

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