JPS5541279A - Resin enclosing device - Google Patents
Resin enclosing deviceInfo
- Publication number
- JPS5541279A JPS5541279A JP11535878A JP11535878A JPS5541279A JP S5541279 A JPS5541279 A JP S5541279A JP 11535878 A JP11535878 A JP 11535878A JP 11535878 A JP11535878 A JP 11535878A JP S5541279 A JPS5541279 A JP S5541279A
- Authority
- JP
- Japan
- Prior art keywords
- metal mold
- slippage
- chases
- thermal expansion
- center blocks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To prevent the positional slippage of products due to thermal deformation and thermal expansion produced under the conditions of the set temperature that seals resin, by mounting convex portions and concave portions to chases and center blocks.
CONSTITUTION: Positional slippage preventive pins 15 and guide bushes 16 are installed to upper and lower chases 5, 6 and center blocks 7, 8 without using the guide posts and guide bushes of a mold metal mold. Since thermal expansion, thermal deformation and elongation of a metal mold base are rigidly free and orientation and positioning are performed only in upper and lower each chase in this metal mold, slippage in other directions is prevented.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11535878A JPS5541279A (en) | 1978-09-19 | 1978-09-19 | Resin enclosing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11535878A JPS5541279A (en) | 1978-09-19 | 1978-09-19 | Resin enclosing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5541279A true JPS5541279A (en) | 1980-03-24 |
Family
ID=14660543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11535878A Pending JPS5541279A (en) | 1978-09-19 | 1978-09-19 | Resin enclosing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5541279A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58157609U (en) * | 1982-04-16 | 1983-10-21 | 松下電器産業株式会社 | Molding equipment |
JPH02249612A (en) * | 1989-03-23 | 1990-10-05 | Yamada Seisakusho:Kk | Mold apparatus |
-
1978
- 1978-09-19 JP JP11535878A patent/JPS5541279A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58157609U (en) * | 1982-04-16 | 1983-10-21 | 松下電器産業株式会社 | Molding equipment |
JPH02249612A (en) * | 1989-03-23 | 1990-10-05 | Yamada Seisakusho:Kk | Mold apparatus |
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