JPS58157609U - Molding equipment - Google Patents

Molding equipment

Info

Publication number
JPS58157609U
JPS58157609U JP5601182U JP5601182U JPS58157609U JP S58157609 U JPS58157609 U JP S58157609U JP 5601182 U JP5601182 U JP 5601182U JP 5601182 U JP5601182 U JP 5601182U JP S58157609 U JPS58157609 U JP S58157609U
Authority
JP
Japan
Prior art keywords
molds
pair
mold clamping
fixed
molding equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5601182U
Other languages
Japanese (ja)
Inventor
中村 時也
大宮 昇治
山脇 準之輔
Original Assignee
松下電器産業株式会社
テイチク株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社, テイチク株式会社 filed Critical 松下電器産業株式会社
Priority to JP5601182U priority Critical patent/JPS58157609U/en
Publication of JPS58157609U publication Critical patent/JPS58157609U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例における円盤記録媒体成形金
型の型取付ボルトおよび型取付ボルト貫通孔を含む要部
断面図、第2図は同円盤状記録媒体成形金型のガイドポ
ストおよびガイドブツシュ10′を含む要部断面図であ
る。 1・・・・・・可動盤、2・・・・・・固定盤、3・・
・・・・下金型、4・・・・・・上金型、5・・・・・
・加熱冷却溝、6・・・・・・型取付ボルト、7・・・
・・・型取付ボルト貫通孔、8・・・・・・緩衝部材、
9・・・・・・ガイドポスト、10・・・・・・ガイド
ブツシュ。
FIG. 1 is a cross-sectional view of the main parts of a mold for molding a disc-shaped recording medium according to an embodiment of the present invention, including a mold mounting bolt and a through-hole for the mold mounting bolt, and FIG. 2 shows a guide post and a mold for molding a disc-shaped recording medium. FIG. 2 is a sectional view of a main part including a guide bush 10'. 1...Movable plate, 2...Fixed plate, 3...
...Lower mold, 4...Upper mold, 5...
・Heating/cooling groove, 6...Model mounting bolt, 7...
...Mold mounting bolt through hole, 8...Buffer member,
9...Guide post, 10...Guide bush.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固定盤及び可動盤を有する型締装置の前記固定盤及び可
動盤に、一対の金型をその一対の金型の少なくともどち
らか一方が型締方向には固定であるが型締方向と直角方
向には移動可能にそれぞれ固定するとともに、前記一対
の金型に互に係合するガイドポストとガイドブツシュを
固定して設けたことを特徴とする成形装置。
A pair of molds is mounted on the fixed plate and movable plate of a mold clamping device having a fixed plate and a movable plate, at least one of the pair of molds is fixed in the mold clamping direction, but in a direction perpendicular to the mold clamping direction. 1. A molding device comprising: a guide post and a guide bush which are movably fixed to the molds, and which are fixedly engaged with the pair of molds.
JP5601182U 1982-04-16 1982-04-16 Molding equipment Pending JPS58157609U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5601182U JPS58157609U (en) 1982-04-16 1982-04-16 Molding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5601182U JPS58157609U (en) 1982-04-16 1982-04-16 Molding equipment

Publications (1)

Publication Number Publication Date
JPS58157609U true JPS58157609U (en) 1983-10-21

Family

ID=30066555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5601182U Pending JPS58157609U (en) 1982-04-16 1982-04-16 Molding equipment

Country Status (1)

Country Link
JP (1) JPS58157609U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01198308A (en) * 1988-02-04 1989-08-09 T & K Internatl Kenkyusho:Kk Method of clamping mold for molding resin seal and mold apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541279A (en) * 1978-09-19 1980-03-24 Nec Kyushu Ltd Resin enclosing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5541279A (en) * 1978-09-19 1980-03-24 Nec Kyushu Ltd Resin enclosing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01198308A (en) * 1988-02-04 1989-08-09 T & K Internatl Kenkyusho:Kk Method of clamping mold for molding resin seal and mold apparatus

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