JPS5538949A - Inside surface electro plating method of metal pipe - Google Patents
Inside surface electro plating method of metal pipeInfo
- Publication number
- JPS5538949A JPS5538949A JP11156278A JP11156278A JPS5538949A JP S5538949 A JPS5538949 A JP S5538949A JP 11156278 A JP11156278 A JP 11156278A JP 11156278 A JP11156278 A JP 11156278A JP S5538949 A JPS5538949 A JP S5538949A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- metal pipe
- electrode
- inside surface
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To eliminate the movement of an electrode rod or metal pipe and enhance workability by inserting the electrode bar wound with a wire-form insulating spacer in spiral form into the center of the pipe at the time of electroplating the inside surface of the metal pipe.
CONSTITUTION: An electrode bar 1 wound partially or intermittently in spiral form with, e.g., an enamel clad copper wire, as a wire-form insualating spacer 2 is inserted into the pipe center of a metal pipe 3. Then, with the electrode bar 1 as anode and the metal pipe 3 as cathode, electroplating is applied to the inside surface of the pipe 3 by supplying electrolyte into the pipe 3 by a pump. Shorting between the electrode 1 and pipe 3 is prevented by the spacer 2 and since the flow of the plating solution becomes better and te production of turbulence becomes less as compared to conventional processes, the dissolution of the electrode 1 and plating are evenly accomplished with current density enhanced and workability improved. In addition plating smoothness is improved as well.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11156278A JPS5538949A (en) | 1978-09-11 | 1978-09-11 | Inside surface electro plating method of metal pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11156278A JPS5538949A (en) | 1978-09-11 | 1978-09-11 | Inside surface electro plating method of metal pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5538949A true JPS5538949A (en) | 1980-03-18 |
Family
ID=14564520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11156278A Pending JPS5538949A (en) | 1978-09-11 | 1978-09-11 | Inside surface electro plating method of metal pipe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5538949A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6196099A (en) * | 1984-10-17 | 1986-05-14 | Mitsubishi Electric Corp | Method and apparatus for plating waveguide |
-
1978
- 1978-09-11 JP JP11156278A patent/JPS5538949A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6196099A (en) * | 1984-10-17 | 1986-05-14 | Mitsubishi Electric Corp | Method and apparatus for plating waveguide |
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