JPS5536215A - Transfer molding composition - Google Patents
Transfer molding compositionInfo
- Publication number
- JPS5536215A JPS5536215A JP10859578A JP10859578A JPS5536215A JP S5536215 A JPS5536215 A JP S5536215A JP 10859578 A JP10859578 A JP 10859578A JP 10859578 A JP10859578 A JP 10859578A JP S5536215 A JPS5536215 A JP S5536215A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- novolak resin
- phenol
- silicon carbide
- finely divided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: The title composition usable for manufacturing molded articles having a high thermal consuctivity, comprising (A) a resin composition of an epoxy novolak resin, its brominated resin and phenol-novolak resin, and (B) a finely divided silicon carbide.
CONSTITUTION: (B) 45W85wt% of finely divided silicon carbide powder having a particle size ≤400 μm is melt kneaded with (A) 55W15wt% of the resin ingredient of (a) an epoxy novolak resin, (b) a phenol-novolak resin at a weight ratio of 1/3W 3:1, and (c) 10W40wt% of a brominated epoxy novolak resin by hot rolls.
EFFECT: Uniform and dense molded anticles having improved flame retaradancy, heat resistance, free from precipitation and setting of fillers in storage and curing can be obtained according to the method.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10859578A JPS5536215A (en) | 1978-09-06 | 1978-09-06 | Transfer molding composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10859578A JPS5536215A (en) | 1978-09-06 | 1978-09-06 | Transfer molding composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5536215A true JPS5536215A (en) | 1980-03-13 |
Family
ID=14488781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10859578A Pending JPS5536215A (en) | 1978-09-06 | 1978-09-06 | Transfer molding composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5536215A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6222847A (en) * | 1985-07-23 | 1987-01-31 | Toshiba Chem Corp | Resin composition for laminated sheet |
JPS63142025A (en) * | 1986-12-05 | 1988-06-14 | Toshiba Chem Corp | Resin composition for sealing use |
-
1978
- 1978-09-06 JP JP10859578A patent/JPS5536215A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6222847A (en) * | 1985-07-23 | 1987-01-31 | Toshiba Chem Corp | Resin composition for laminated sheet |
JPS63142025A (en) * | 1986-12-05 | 1988-06-14 | Toshiba Chem Corp | Resin composition for sealing use |
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