JPS5534425A - Wafer dicing device - Google Patents
Wafer dicing deviceInfo
- Publication number
- JPS5534425A JPS5534425A JP10641478A JP10641478A JPS5534425A JP S5534425 A JPS5534425 A JP S5534425A JP 10641478 A JP10641478 A JP 10641478A JP 10641478 A JP10641478 A JP 10641478A JP S5534425 A JPS5534425 A JP S5534425A
- Authority
- JP
- Japan
- Prior art keywords
- turntable
- wafers
- dicing
- mounting
- dismounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To provide a plurality of holding members for carrying out holding of wafers and control of the rotational angle thereof on a turntable, and arrange a dicing mechanism and a mounting and dismounting mechanism around the periphery of said turntable thereby to carry out in parallel various process steps relative to the dicing.
CONSTITUTION: A plurality of holding members 6 which hold wafers 12 and whose rotational angle is controlled by a control mechanism are provided on a turntable 2, and a dicing mechanism 20, a mounting and dismounting mechanism 21 and a locating mechanism 36 are provided around the turntable. Firstly, in the holding member 6 corresponding to the dicing mechanism 20, the wafers 12 are located by the locating mechanism 36 and subjected to dicing. During this operation, in the holding member 6 corresponding to the mounting and dismounting mechanism 21 there are effected the mounting and dismounting operations of the wafers 12, and in the holding member 6 corresponding to the locating mechanism 22 there is effected the locating operation of the wafers 12. After the completion of the dicing, the turntable 2 is rotated in a direction indicated by a, and the wafers 12 on respective holding members 6 are shifted to the subsequent step, and after the completion of the entire step, the turntable 2 is restored to the initial position.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10641478A JPS5534425A (en) | 1978-08-31 | 1978-08-31 | Wafer dicing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10641478A JPS5534425A (en) | 1978-08-31 | 1978-08-31 | Wafer dicing device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5534425A true JPS5534425A (en) | 1980-03-11 |
Family
ID=14433001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10641478A Pending JPS5534425A (en) | 1978-08-31 | 1978-08-31 | Wafer dicing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5534425A (en) |
-
1978
- 1978-08-31 JP JP10641478A patent/JPS5534425A/en active Pending
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