JPS5534425A - Wafer dicing device - Google Patents

Wafer dicing device

Info

Publication number
JPS5534425A
JPS5534425A JP10641478A JP10641478A JPS5534425A JP S5534425 A JPS5534425 A JP S5534425A JP 10641478 A JP10641478 A JP 10641478A JP 10641478 A JP10641478 A JP 10641478A JP S5534425 A JPS5534425 A JP S5534425A
Authority
JP
Japan
Prior art keywords
turntable
wafers
dicing
mounting
dismounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10641478A
Other languages
Japanese (ja)
Inventor
Mitsuo Sumiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10641478A priority Critical patent/JPS5534425A/en
Publication of JPS5534425A publication Critical patent/JPS5534425A/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To provide a plurality of holding members for carrying out holding of wafers and control of the rotational angle thereof on a turntable, and arrange a dicing mechanism and a mounting and dismounting mechanism around the periphery of said turntable thereby to carry out in parallel various process steps relative to the dicing.
CONSTITUTION: A plurality of holding members 6 which hold wafers 12 and whose rotational angle is controlled by a control mechanism are provided on a turntable 2, and a dicing mechanism 20, a mounting and dismounting mechanism 21 and a locating mechanism 36 are provided around the turntable. Firstly, in the holding member 6 corresponding to the dicing mechanism 20, the wafers 12 are located by the locating mechanism 36 and subjected to dicing. During this operation, in the holding member 6 corresponding to the mounting and dismounting mechanism 21 there are effected the mounting and dismounting operations of the wafers 12, and in the holding member 6 corresponding to the locating mechanism 22 there is effected the locating operation of the wafers 12. After the completion of the dicing, the turntable 2 is rotated in a direction indicated by a, and the wafers 12 on respective holding members 6 are shifted to the subsequent step, and after the completion of the entire step, the turntable 2 is restored to the initial position.
COPYRIGHT: (C)1980,JPO&Japio
JP10641478A 1978-08-31 1978-08-31 Wafer dicing device Pending JPS5534425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10641478A JPS5534425A (en) 1978-08-31 1978-08-31 Wafer dicing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10641478A JPS5534425A (en) 1978-08-31 1978-08-31 Wafer dicing device

Publications (1)

Publication Number Publication Date
JPS5534425A true JPS5534425A (en) 1980-03-11

Family

ID=14433001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10641478A Pending JPS5534425A (en) 1978-08-31 1978-08-31 Wafer dicing device

Country Status (1)

Country Link
JP (1) JPS5534425A (en)

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