JPS552763A - Electrolysis method of chlorine compound etching solution - Google Patents

Electrolysis method of chlorine compound etching solution

Info

Publication number
JPS552763A
JPS552763A JP7547978A JP7547978A JPS552763A JP S552763 A JPS552763 A JP S552763A JP 7547978 A JP7547978 A JP 7547978A JP 7547978 A JP7547978 A JP 7547978A JP S552763 A JPS552763 A JP S552763A
Authority
JP
Japan
Prior art keywords
etching solution
cell
absorption
chlorine gas
absorption cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7547978A
Other languages
Japanese (ja)
Other versions
JPS582272B2 (en
Inventor
Hideo Tsubaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP53075479A priority Critical patent/JPS582272B2/en
Publication of JPS552763A publication Critical patent/JPS552763A/en
Publication of JPS582272B2 publication Critical patent/JPS582272B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: To reduce replenishing amount of chlorine and improve electrolysis efficiency by leading the etching solution which has recovered metals and the chlorine gas evolved in anode from the electrolytic cell into an absorption cell and returning the chlorine gas exhausted from the absorption cell into the electrolytic cell.
CONSTITUTION: Etching solution which contains a large amount of copper by etching printed substrates and the like is sent from a storage takn 1 into an electrolytic cell, where electrolysis is performed and the copper deposited on the cathode is recovered from a take-out port 21. The etching solution which copper has been recovered is fed to the lower part of an absorption cell 3 and the chlorine gas evolved on the anode side is fed to the blow-out pipe 32 of the absorption cell 3, allowing its primary absorption into the etching solution in the lower part of the absorption cell 3 to take place. Further, its secondary absorption into the circulating etching solution is let to take place by a pump 92. The remaining chlorine gas is returned from the top of the absorption cell 3 into the chamber 23 of the electrolytic cell 2. The etching solution having absorbed the chlorine gas is sent from the absorption cell 3 to a mixing cell 6, where the deficiency of chlorine is measured. The hydrochloric acid of the amount corresponding to the deficiency is sent from a dydrochloric acid tank 5 into the mixing cell 6, by which the etching solution is regenerated. The regenated etching solution is then fed into a regenerated solution storage tank 7.
COPYRIGHT: (C)1980,JPO&Japio
JP53075479A 1978-06-23 1978-06-23 Electrolysis method of chlorine compound corrosive solution Expired JPS582272B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53075479A JPS582272B2 (en) 1978-06-23 1978-06-23 Electrolysis method of chlorine compound corrosive solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53075479A JPS582272B2 (en) 1978-06-23 1978-06-23 Electrolysis method of chlorine compound corrosive solution

Publications (2)

Publication Number Publication Date
JPS552763A true JPS552763A (en) 1980-01-10
JPS582272B2 JPS582272B2 (en) 1983-01-14

Family

ID=13577462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53075479A Expired JPS582272B2 (en) 1978-06-23 1978-06-23 Electrolysis method of chlorine compound corrosive solution

Country Status (1)

Country Link
JP (1) JPS582272B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05117879A (en) * 1991-10-28 1993-05-14 Nittetsu Mining Co Ltd Treatment of etching liquid
JPH06240475A (en) * 1993-02-16 1994-08-30 Nittetsu Mining Co Ltd Treatment of iron chloride based etchant containing nickel
WO2004111308A1 (en) * 2003-06-13 2004-12-23 Atotech Deutschland Gmbh Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51119632A (en) * 1975-04-15 1976-10-20 Chiyuuoo Kk Process for treating etching agents

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51119632A (en) * 1975-04-15 1976-10-20 Chiyuuoo Kk Process for treating etching agents

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05117879A (en) * 1991-10-28 1993-05-14 Nittetsu Mining Co Ltd Treatment of etching liquid
JPH06240475A (en) * 1993-02-16 1994-08-30 Nittetsu Mining Co Ltd Treatment of iron chloride based etchant containing nickel
WO2004111308A1 (en) * 2003-06-13 2004-12-23 Atotech Deutschland Gmbh Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method
CN100413999C (en) * 2003-06-13 2008-08-27 德国艾托科技公司 Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method
US7520973B2 (en) 2003-06-13 2009-04-21 Atotech Deutschland Gmbh Method for regenerating etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out said method
KR101052245B1 (en) 2003-06-13 2011-07-27 아토테크더치랜드게엠베하 Regeneration method of iron-containing etching liquid for etching or pickling copper or copper alloy and apparatus for performing the method

Also Published As

Publication number Publication date
JPS582272B2 (en) 1983-01-14

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