JPS551979A - Resistance welding method - Google Patents

Resistance welding method

Info

Publication number
JPS551979A
JPS551979A JP1617179A JP1617179A JPS551979A JP S551979 A JPS551979 A JP S551979A JP 1617179 A JP1617179 A JP 1617179A JP 1617179 A JP1617179 A JP 1617179A JP S551979 A JPS551979 A JP S551979A
Authority
JP
Japan
Prior art keywords
wire
electrode
lead
welding
longitudinal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1617179A
Other languages
Japanese (ja)
Inventor
Mitsuo Ito
Koichi Taguchi
Yoshio Ohashi
Kimitoshi Aoshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1617179A priority Critical patent/JPS551979A/en
Publication of JPS551979A publication Critical patent/JPS551979A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8536—Bonding interfaces of the semiconductor or solid state body
    • H01L2224/85365—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To prevent occurrence of spatter, spark, etc. and improve the yield, by including the intersecting part of metal wires with the ends of a pair of electrodes, and disposing and welding metal wires in the longitudinal direction of at least one electrode of which end plane presents a roughly rectangular form.
CONSTITUTION: A lower welding electrode 10, made of a copper bar or the like, of which peripheral parts at both sides of end plane 11 are cut off and end part is designed to have a rectangular section is disposed so that the longitudinal direction thereof may run in the direction in which a lead 12 extends. On the other hand, the end part of an upper welding electrode 14, made of copper or the like, which is to push down a connector wire 13 to be intersected on the lead 12 is also formed in an approximate rectangular form, and the longitudinal direction thereof is caused to coincide with the stretching direction of the wire 13. Voltage is applied to both electrodes 10, 14, and the lead 12 and wire 13 are joined by resistance welding. At this time, since the width in the direction orthogonal to the stretching direction of wire 13 of the electrode 14 is roughly constant, even if the intersecting position of the wire 13 with respect to the lead 12 is deviated, the contact length of the wire 13 and electrode 14 remains almost constant, so that the contact pressure is always constant. Therefore, secure welding is achieved.
COPYRIGHT: (C)1980,JPO&Japio
JP1617179A 1979-02-16 1979-02-16 Resistance welding method Pending JPS551979A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1617179A JPS551979A (en) 1979-02-16 1979-02-16 Resistance welding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1617179A JPS551979A (en) 1979-02-16 1979-02-16 Resistance welding method

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11314676A Division JPS5339237A (en) 1976-09-22 1976-09-22 Welding electrode for resistance welding of crossed wiress

Publications (1)

Publication Number Publication Date
JPS551979A true JPS551979A (en) 1980-01-09

Family

ID=11909056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1617179A Pending JPS551979A (en) 1979-02-16 1979-02-16 Resistance welding method

Country Status (1)

Country Link
JP (1) JPS551979A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10383465B2 (en) 2012-04-12 2019-08-20 Cabeau, Inc. Travel pillow with lateral and rear support bar and a flat and thin back

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10383465B2 (en) 2012-04-12 2019-08-20 Cabeau, Inc. Travel pillow with lateral and rear support bar and a flat and thin back

Similar Documents

Publication Publication Date Title
KR840000057A (en) Fuse parts for small plug-in fuses
TWM318808U (en) Battery guiding piece
PT77681B (en) DEVICE WITH U-FOAMIGEN LSA-PLUS CONNECTION CONTACTS
FR2360186A1 (en) SLOTTED ELECTRICAL CONNECTOR
DE3468826D1 (en) Method for electrical seam-resistance welding with only one electrode wire, and a welding machine for performing the method, and application of it
HK145494A (en) Method for forming a cutting contact element
JPS551979A (en) Resistance welding method
KR860007761A (en) Electrical lead tube terminal and manufacturing method
JPS6414813A (en) Manufacture of shielded tape electric wire
EP0219285B1 (en) Assembly of a substrate, an electrical device and a terminal
ATE20160T1 (en) WIRE STRIPPING AND PULLING ARRANGEMENT.
KR950030417A (en) Terminal lead for electronic parts and manufacturing apparatus
JPS56129414A (en) Soldering method of reed wire to piezoelectric oscillator
SE8603024L (en) LIST OF WORK CONTACTS
JPS5529135A (en) Superconductive coil
GB1126675A (en)
ES245188U (en) Contact elements for fuses
KR890008357Y1 (en) Arc welding electrode
JPS6446907A (en) Coil device
KR810002591Y1 (en) Electrode of condenser
FR2610454B1 (en) DEVICE PROVIDING IMPROVED ELECTRICAL CONTACT BETWEEN AN ELECTRICAL CONDUCTOR AND AN ELECTRODE OR AN ELECTRODE-HOLDING ELEMENT; USE OF THIS DEVICE IN ANY DEVICE FOR ADVANCING AN ELECTRODE OR AN ELECTRODE-HOLDING ELEMENT
JPS6327427Y2 (en)
SU659312A1 (en) Electrode holder for electrode waste-free welding
JPS6243308B2 (en)
KR810002593Y1 (en) Electrode of condenser