JPS55165659A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55165659A
JPS55165659A JP7318179A JP7318179A JPS55165659A JP S55165659 A JPS55165659 A JP S55165659A JP 7318179 A JP7318179 A JP 7318179A JP 7318179 A JP7318179 A JP 7318179A JP S55165659 A JPS55165659 A JP S55165659A
Authority
JP
Japan
Prior art keywords
opening
carrier
board
radiator
central part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7318179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142865B2 (enFirst
Inventor
Norio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7318179A priority Critical patent/JPS55165659A/ja
Publication of JPS55165659A publication Critical patent/JPS55165659A/ja
Publication of JPS6142865B2 publication Critical patent/JPS6142865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP7318179A 1979-06-11 1979-06-11 Semiconductor device Granted JPS55165659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7318179A JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55165659A true JPS55165659A (en) 1980-12-24
JPS6142865B2 JPS6142865B2 (enFirst) 1986-09-24

Family

ID=13510705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7318179A Granted JPS55165659A (en) 1979-06-11 1979-06-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55165659A (enFirst)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603860A3 (en) * 1992-12-23 1995-03-15 Hughes Aircraft Co Integrated extensive cooling surfaces for power modules.
CN107316852A (zh) * 2017-08-08 2017-11-03 苏州能讯高能半导体有限公司 一种半导体器件的散热结构及半导体器件

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599752A (en) * 1979-01-25 1980-07-30 Chiyou Lsi Gijutsu Kenkyu Kumiai Structure for fitting ic chip

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5599752A (en) * 1979-01-25 1980-07-30 Chiyou Lsi Gijutsu Kenkyu Kumiai Structure for fitting ic chip

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0603860A3 (en) * 1992-12-23 1995-03-15 Hughes Aircraft Co Integrated extensive cooling surfaces for power modules.
CN107316852A (zh) * 2017-08-08 2017-11-03 苏州能讯高能半导体有限公司 一种半导体器件的散热结构及半导体器件
CN107316852B (zh) * 2017-08-08 2019-09-27 苏州能讯高能半导体有限公司 一种半导体器件的散热结构及半导体器件

Also Published As

Publication number Publication date
JPS6142865B2 (enFirst) 1986-09-24

Similar Documents

Publication Publication Date Title
US4489363A (en) Apparatus for cooling integrated circuit chips
KR960012449A (ko) 반도체장치
JPS55128851A (en) Semiconductor memory device
JPS55165659A (en) Semiconductor device
JPS6037756A (ja) 半導体装置
TWI298938B (enFirst)
JPH04316357A (ja) 樹脂封止型半導体装置
JPS57166051A (en) Semiconductor device
JP2669924B2 (ja) 浸漬冷却装置
JPS55165657A (en) Multi-chip package
JPS5559746A (en) Semiconductor device and its mounting circuit device
JPS54128278A (en) Resin-sealed semiconductor device and its packaging method
JPS6111469B2 (enFirst)
JPS6118864B2 (enFirst)
JPS56133853A (en) Package for integrating circuit
JPS5720440A (en) Semiconductor device
JPS5559754A (en) Semiconductor device
JPS56137662A (en) Semiconductor device
JP2002050726A (ja) 半導体装置
KR940010291A (ko) 다핀용 반도체 패키지
JPS5651849A (en) Cooling device for integrated circuit
JPS6228491U (enFirst)
JPS6057139U (ja) 集積回路チツプ冷却装置
JPS5571051A (en) Semiconductor device
JPS57121262A (en) Semiconductor device and manufacture thereof