JPS55158654A - Manufacture of heat sink in aluminum - Google Patents

Manufacture of heat sink in aluminum

Info

Publication number
JPS55158654A
JPS55158654A JP6777979A JP6777979A JPS55158654A JP S55158654 A JPS55158654 A JP S55158654A JP 6777979 A JP6777979 A JP 6777979A JP 6777979 A JP6777979 A JP 6777979A JP S55158654 A JPS55158654 A JP S55158654A
Authority
JP
Japan
Prior art keywords
pieces
heat sink
plate
mass
produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6777979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6112384B2 (enExample
Inventor
Masao Niki
Korehiko Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aichi Steel Corp
Original Assignee
Aichi Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aichi Steel Corp filed Critical Aichi Steel Corp
Priority to JP6777979A priority Critical patent/JPS55158654A/ja
Publication of JPS55158654A publication Critical patent/JPS55158654A/ja
Publication of JPS6112384B2 publication Critical patent/JPS6112384B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP6777979A 1979-05-30 1979-05-30 Manufacture of heat sink in aluminum Granted JPS55158654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6777979A JPS55158654A (en) 1979-05-30 1979-05-30 Manufacture of heat sink in aluminum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6777979A JPS55158654A (en) 1979-05-30 1979-05-30 Manufacture of heat sink in aluminum

Publications (2)

Publication Number Publication Date
JPS55158654A true JPS55158654A (en) 1980-12-10
JPS6112384B2 JPS6112384B2 (enExample) 1986-04-08

Family

ID=13354774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6777979A Granted JPS55158654A (en) 1979-05-30 1979-05-30 Manufacture of heat sink in aluminum

Country Status (1)

Country Link
JP (1) JPS55158654A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852836A (ja) * 1981-09-24 1983-03-29 Fuji Electric Co Ltd 複合集積回路
US5448107A (en) * 1989-12-29 1995-09-05 Sumitomo Electric Industries, Ltd. Radiating fin having an improved life and thermal conductivity
JP2011220582A (ja) * 2010-04-07 2011-11-04 Denso Corp 熱交換器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5852836A (ja) * 1981-09-24 1983-03-29 Fuji Electric Co Ltd 複合集積回路
US5448107A (en) * 1989-12-29 1995-09-05 Sumitomo Electric Industries, Ltd. Radiating fin having an improved life and thermal conductivity
JP2011220582A (ja) * 2010-04-07 2011-11-04 Denso Corp 熱交換器

Also Published As

Publication number Publication date
JPS6112384B2 (enExample) 1986-04-08

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