JPS55157471A - Dish for bonding workpieces - Google Patents
Dish for bonding workpiecesInfo
- Publication number
- JPS55157471A JPS55157471A JP6102779A JP6102779A JPS55157471A JP S55157471 A JPS55157471 A JP S55157471A JP 6102779 A JP6102779 A JP 6102779A JP 6102779 A JP6102779 A JP 6102779A JP S55157471 A JPS55157471 A JP S55157471A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- dish
- bonding surface
- thermal
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
PURPOSE:To produce a high-precision dish for bonding workpieces, by compensating thermal deformation caused by polishing materials with different coefficients of thermal expansion. CONSTITUTION:Thermal distribution caused by polishing a bonding dish in the direction of thickness is approximately linear, the temperature on a bonding surface A being higher than that on the opposie side. This generates a bending moment to deform the bonding dish 1, so that the bonding surface A becomes convex. Since a disc 6, made of different material and clamped to the side B opposite to the bonding surface A, has a coefficient of thermal expansion larger than that of the bonding plate 1, its elongation is large enough to generate a bending moment for deforming the bonding plate 1, so that the work bonding surface A becomes concave, despite the fact that the temperature on the opposite side B is smaller than that on the bonding surface A. The thickness of the disc 6 made of foreign material is adjusted to balance both moments, which can produce a high-precision bonding dish 1 without thermal deformation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6102779A JPS55157471A (en) | 1979-05-19 | 1979-05-19 | Dish for bonding workpieces |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6102779A JPS55157471A (en) | 1979-05-19 | 1979-05-19 | Dish for bonding workpieces |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55157471A true JPS55157471A (en) | 1980-12-08 |
JPS5742472B2 JPS5742472B2 (en) | 1982-09-08 |
Family
ID=13159403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6102779A Granted JPS55157471A (en) | 1979-05-19 | 1979-05-19 | Dish for bonding workpieces |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55157471A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100755011B1 (en) * | 2005-12-14 | 2007-09-06 | 주식회사 실트론 | Polishing plate, and polishing apparatus, polishing method using thereof |
CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58190780U (en) * | 1982-06-11 | 1983-12-19 | 富士電機株式会社 | Vending machine with games |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51111993A (en) * | 1975-03-27 | 1976-10-02 | Supiide Fuamu Kk | Apparatus for fabricating thin work as semiconductor or the like |
-
1979
- 1979-05-19 JP JP6102779A patent/JPS55157471A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51111993A (en) * | 1975-03-27 | 1976-10-02 | Supiide Fuamu Kk | Apparatus for fabricating thin work as semiconductor or the like |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100755011B1 (en) * | 2005-12-14 | 2007-09-06 | 주식회사 실트론 | Polishing plate, and polishing apparatus, polishing method using thereof |
CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
Also Published As
Publication number | Publication date |
---|---|
JPS5742472B2 (en) | 1982-09-08 |
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