JPS55152170A - Coating material for plating base - Google Patents
Coating material for plating baseInfo
- Publication number
- JPS55152170A JPS55152170A JP6120079A JP6120079A JPS55152170A JP S55152170 A JPS55152170 A JP S55152170A JP 6120079 A JP6120079 A JP 6120079A JP 6120079 A JP6120079 A JP 6120079A JP S55152170 A JPS55152170 A JP S55152170A
- Authority
- JP
- Japan
- Prior art keywords
- coating material
- powder
- caco
- base
- pts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To enhance the plate-bonding properties of surface treatment coating material on base for chemical plating by a method wherein the coating material is formed from liquid diene polymer having end (OH) gp. and containing dispersed mixture of specific amount of powder consisting of CaCO3 or mica, and di(poly) isocyanate.
CONSTITUTION: The coating material for pretreatment of base surface for chemical plating, such as the base of insulating resin, is formed as follows: To 100wt.pts. of liquid diene polymer having end (OH) gp. (e.g. polybutadiene with end (OH) gp.), 5W70wt.pts. of powder essentially consisting of CaCO3 (e.g. 100% CaCO3, or marble powder) or mica powder is added and mixed, to which di(poly)isocyanate (e.g. toluenediisocyanate) is added. The product is excellent in electric insulating properties, and resistance to soldering heat, chemicals and water, is effective in increasing the plating bond strength, and thereby provides a metal coated layed well adhered to the base surface.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6120079A JPS55152170A (en) | 1979-05-17 | 1979-05-17 | Coating material for plating base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6120079A JPS55152170A (en) | 1979-05-17 | 1979-05-17 | Coating material for plating base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55152170A true JPS55152170A (en) | 1980-11-27 |
Family
ID=13164294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6120079A Pending JPS55152170A (en) | 1979-05-17 | 1979-05-17 | Coating material for plating base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55152170A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101405434B (en) | 2006-03-23 | 2011-09-28 | 木本股份有限公司 | Material to be plated by electroless plating and method of forming electroless plating layer using same |
-
1979
- 1979-05-17 JP JP6120079A patent/JPS55152170A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101405434B (en) | 2006-03-23 | 2011-09-28 | 木本股份有限公司 | Material to be plated by electroless plating and method of forming electroless plating layer using same |
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