JPS55150258A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55150258A
JPS55150258A JP4139579A JP4139579A JPS55150258A JP S55150258 A JPS55150258 A JP S55150258A JP 4139579 A JP4139579 A JP 4139579A JP 4139579 A JP4139579 A JP 4139579A JP S55150258 A JPS55150258 A JP S55150258A
Authority
JP
Japan
Prior art keywords
pellet
resin
semiconductor
lead frame
impurity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4139579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5728953B2 (enExample
Inventor
Hiroshi Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Toyo Electronics Industry Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, Toyo Electronics Industry Corp filed Critical Rohm Co Ltd
Priority to JP4139579A priority Critical patent/JPS55150258A/ja
Publication of JPS55150258A publication Critical patent/JPS55150258A/ja
Publication of JPS5728953B2 publication Critical patent/JPS5728953B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP4139579A 1979-04-04 1979-04-04 Semiconductor device Granted JPS55150258A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4139579A JPS55150258A (en) 1979-04-04 1979-04-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4139579A JPS55150258A (en) 1979-04-04 1979-04-04 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS55150258A true JPS55150258A (en) 1980-11-22
JPS5728953B2 JPS5728953B2 (enExample) 1982-06-19

Family

ID=12607181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4139579A Granted JPS55150258A (en) 1979-04-04 1979-04-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55150258A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177347A (ja) * 1984-09-21 1986-04-19 Rohm Co Ltd 半導体製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02128875U (enExample) * 1989-03-31 1990-10-24

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2712172A1 (de) * 1977-03-19 1978-09-21 Licentia Gmbh Einkapselungsmaterial fuer solarzellen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2712172A1 (de) * 1977-03-19 1978-09-21 Licentia Gmbh Einkapselungsmaterial fuer solarzellen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177347A (ja) * 1984-09-21 1986-04-19 Rohm Co Ltd 半導体製造方法

Also Published As

Publication number Publication date
JPS5728953B2 (enExample) 1982-06-19

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