JPS55147100A - Ultrasonic wave probe - Google Patents

Ultrasonic wave probe

Info

Publication number
JPS55147100A
JPS55147100A JP16681279A JP16681279A JPS55147100A JP S55147100 A JPS55147100 A JP S55147100A JP 16681279 A JP16681279 A JP 16681279A JP 16681279 A JP16681279 A JP 16681279A JP S55147100 A JPS55147100 A JP S55147100A
Authority
JP
Japan
Prior art keywords
oscillation
piezoelectric
material plate
plate
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16681279A
Other languages
Japanese (ja)
Other versions
JPS5636639B2 (en
Inventor
Kazuhiro Iinuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16681279A priority Critical patent/JPS55147100A/en
Publication of JPS55147100A publication Critical patent/JPS55147100A/en
Publication of JPS5636639B2 publication Critical patent/JPS5636639B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

PURPOSE:To arrange the characteristics of each element and to obtain excellent directivity, by forming the oscillation element group by cutting off the piezoelectric oscillation material sticked to the absorbing unit and not using the ends as the oscillating element. CONSTITUTION:The piezoelectric oscillation material plate 1 bonding the electrodes on the both sides is fitted on the ultrasonic absorbing plate 2. Further, the cut 3 reaching the absorbing plate 2 is given to the material plate 1 with a given interval, and the part of the piezoelectric oscillating material plate remaining between the cuts are respectively the oscillation element 4 to form the element group, and the parts 5, 5 left at the both ends are not used as the element. Next, the low impedance layer 6 and the film 7 having close impedance to that of a living body are coated. Thus, since the element group is formed with cutting, the characteristics of each element can easily be arranged. Since the both ends can not be taken as the element, the edge effect is removed and excellent directivity can be obtained.
JP16681279A 1979-12-24 1979-12-24 Ultrasonic wave probe Granted JPS55147100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16681279A JPS55147100A (en) 1979-12-24 1979-12-24 Ultrasonic wave probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16681279A JPS55147100A (en) 1979-12-24 1979-12-24 Ultrasonic wave probe

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP732634A Division JPS5636638B2 (en) 1972-12-29 1972-12-29

Publications (2)

Publication Number Publication Date
JPS55147100A true JPS55147100A (en) 1980-11-15
JPS5636639B2 JPS5636639B2 (en) 1981-08-25

Family

ID=15838117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16681279A Granted JPS55147100A (en) 1979-12-24 1979-12-24 Ultrasonic wave probe

Country Status (1)

Country Link
JP (1) JPS55147100A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60199435A (en) * 1984-03-24 1985-10-08 株式会社東芝 Ultrasonic probe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60199435A (en) * 1984-03-24 1985-10-08 株式会社東芝 Ultrasonic probe

Also Published As

Publication number Publication date
JPS5636639B2 (en) 1981-08-25

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