JPS5513341B2 - - Google Patents
Info
- Publication number
- JPS5513341B2 JPS5513341B2 JP12174775A JP12174775A JPS5513341B2 JP S5513341 B2 JPS5513341 B2 JP S5513341B2 JP 12174775 A JP12174775 A JP 12174775A JP 12174775 A JP12174775 A JP 12174775A JP S5513341 B2 JPS5513341 B2 JP S5513341B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US51311274A | 1974-10-08 | 1974-10-08 | |
US56890475A | 1975-04-17 | 1975-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5163702A JPS5163702A (en) | 1976-06-02 |
JPS5513341B2 true JPS5513341B2 (en) | 1980-04-08 |
Family
ID=27057750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12174775A Granted JPS5163702A (en) | 1974-10-08 | 1975-10-08 | SHINKUSE KISOHO |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5163702A (en) |
DE (1) | DE2544553C2 (en) |
FR (1) | FR2287714A1 (en) |
GB (1) | GB1517302A (en) |
NL (1) | NL7511714A (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4069076A (en) * | 1976-11-29 | 1978-01-17 | E. I. Du Pont De Nemours And Company | Liquid lamination process |
JPS5489274A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of making printed board |
US4289480A (en) * | 1979-11-02 | 1981-09-15 | E. I. Du Pont De Nemours And Company | Process for heating thin surface layers |
DE3342678C2 (en) * | 1983-11-25 | 1995-08-31 | Held Kurt | Method and device for the continuous production of metal-clad laminates |
JPS6252552A (en) * | 1985-08-30 | 1987-03-07 | Hitachi Chem Co Ltd | Method and device for vacuum sticking |
JPS63259559A (en) * | 1987-04-16 | 1988-10-26 | Hitachi Condenser Co Ltd | Pattern forming method for printed circuit board |
DE3737945A1 (en) * | 1987-11-07 | 1989-05-24 | Anger Wolfgang | Vacuum laminator |
US4834821A (en) * | 1988-01-11 | 1989-05-30 | Morton Thiokol, Inc. | Process for preparing polymeric materials for application to printed circuits |
DK8689A (en) * | 1988-01-11 | 1989-07-12 | Thiokol Morton Inc | PROCEDURE AND APPARATUS FOR PLACING POLYMER MATERIALS ON PRINTED CIRCUIT CARDS |
US4992354A (en) * | 1988-02-26 | 1991-02-12 | Morton International, Inc. | Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like |
US5078820A (en) * | 1988-03-25 | 1992-01-07 | Somar Corporation | Method and apparatus for pressure sticking a thin film to a base plate |
US4927733A (en) * | 1988-12-23 | 1990-05-22 | E. I. Du Pont De Nemours And Company | Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing |
DE4018177A1 (en) * | 1990-06-07 | 1991-12-12 | Anger Electronic Gmbh | Continuous circuit board polymer film lamination - using multichamber vacuum cladding appts. to allow continuous one- or two-side cladding |
DE4026802A1 (en) * | 1990-08-24 | 1992-02-27 | Anger Electronic Gmbh | Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure |
DE4222262A1 (en) * | 1991-09-03 | 1993-03-04 | Anger Electronic Gmbh | Appts. for laminating plastics prods. e.g. PVC films esp. in PCB mfr. - has vacuum chamber comprising 2 opposing movable platens, each having pressure mat backed by heating mats for receiving prod connected by thin polyester band |
DE9111708U1 (en) * | 1991-09-19 | 1992-04-16 | Anger Electronic Ges.M.B.H. Emco Innovationscenter, Hallein, At | |
IT1274181B (en) * | 1994-05-18 | 1997-07-15 | Amedeo Candore | LAMINATION OF PHOTOSENSITIVE FILMS TO FORM A WELDING MASK ON PRINTED CIRCUIT BOARDS |
DE19609590A1 (en) * | 1996-03-12 | 1997-09-18 | Kontron Elektronik | Method and device for coating substrates, preferably printed circuit boards |
MY120763A (en) | 1997-09-19 | 2005-11-30 | Hitachi Chemical Co Ltd | Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer |
EP1117006A1 (en) * | 2000-01-14 | 2001-07-18 | Shipley Company LLC | Photoresist having increased photospeed |
US7067226B2 (en) | 2001-03-29 | 2006-06-27 | Hitachi Chemical Co., Ltd. | Photosensitive film for circuit formation and process for producing printed wiring board |
US8801887B2 (en) † | 2005-12-23 | 2014-08-12 | The Boeing Company | Textured structure and method of making the textured structure |
JP5647247B2 (en) | 2009-08-13 | 2014-12-24 | ダウ グローバル テクノロジーズ エルエルシー | Multilayer laminated structure and manufacturing method |
WO2012082613A2 (en) | 2010-12-17 | 2012-06-21 | Dow Global Technologies Llc | Improved photovoltaic device |
CN113473709B (en) * | 2020-03-31 | 2022-05-31 | 竞华电子(深圳)有限公司 | Printed circuit board processing method and printed circuit board |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3305416A (en) * | 1963-12-30 | 1967-02-21 | Ibm | Method for making printed circuits |
US3329549A (en) * | 1963-08-14 | 1967-07-04 | Leonard J Vilutis | Film laminating apparatus and method |
JPS449363Y1 (en) * | 1968-08-05 | 1969-04-16 | ||
JPS4518324Y1 (en) * | 1966-12-19 | 1970-07-27 | ||
GB1314845A (en) * | 1969-10-25 | 1973-04-26 | Dornbusch Maschf | Process for surface welding of heated webs in particular thermoplastic foils and an apparatus for carrying out this process |
GB1321546A (en) * | 1970-12-11 | 1973-06-27 | Saint Gobain | Process for producing laminated safety panes |
JPS48100201A (en) * | 1972-04-04 | 1973-12-18 | ||
JPS4931401A (en) * | 1972-07-20 | 1974-03-20 | ||
JPS49103167A (en) * | 1973-02-08 | 1974-09-30 | ||
JPS49103159A (en) * | 1973-02-08 | 1974-09-30 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1293655B (en) * | 1969-04-24 | |||
US3042574A (en) * | 1957-09-25 | 1962-07-03 | Du Pont | Method of making laminated structures |
US3469982A (en) * | 1968-09-11 | 1969-09-30 | Jack Richard Celeste | Process for making photoresists |
-
1975
- 1975-10-04 DE DE19752544553 patent/DE2544553C2/en not_active Expired
- 1975-10-06 GB GB4085375A patent/GB1517302A/en not_active Expired
- 1975-10-06 NL NL7511714A patent/NL7511714A/en not_active Application Discontinuation
- 1975-10-07 FR FR7530652A patent/FR2287714A1/en active Granted
- 1975-10-08 JP JP12174775A patent/JPS5163702A/en active Granted
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3329549A (en) * | 1963-08-14 | 1967-07-04 | Leonard J Vilutis | Film laminating apparatus and method |
US3305416A (en) * | 1963-12-30 | 1967-02-21 | Ibm | Method for making printed circuits |
JPS4518324Y1 (en) * | 1966-12-19 | 1970-07-27 | ||
JPS449363Y1 (en) * | 1968-08-05 | 1969-04-16 | ||
GB1314845A (en) * | 1969-10-25 | 1973-04-26 | Dornbusch Maschf | Process for surface welding of heated webs in particular thermoplastic foils and an apparatus for carrying out this process |
GB1321546A (en) * | 1970-12-11 | 1973-06-27 | Saint Gobain | Process for producing laminated safety panes |
JPS48100201A (en) * | 1972-04-04 | 1973-12-18 | ||
JPS4931401A (en) * | 1972-07-20 | 1974-03-20 | ||
JPS49103167A (en) * | 1973-02-08 | 1974-09-30 | ||
JPS49103159A (en) * | 1973-02-08 | 1974-09-30 |
Also Published As
Publication number | Publication date |
---|---|
FR2287714B1 (en) | 1982-10-15 |
DE2544553C2 (en) | 1983-08-04 |
DE2544553A1 (en) | 1976-04-22 |
NL7511714A (en) | 1976-04-12 |
FR2287714A1 (en) | 1976-05-07 |
JPS5163702A (en) | 1976-06-02 |
GB1517302A (en) | 1978-07-12 |