DE4026802A1 - Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure - Google Patents

Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure

Info

Publication number
DE4026802A1
DE4026802A1 DE19904026802 DE4026802A DE4026802A1 DE 4026802 A1 DE4026802 A1 DE 4026802A1 DE 19904026802 DE19904026802 DE 19904026802 DE 4026802 A DE4026802 A DE 4026802A DE 4026802 A1 DE4026802 A1 DE 4026802A1
Authority
DE
Germany
Prior art keywords
vacuum chamber
film
circuit board
pressure
conveyor belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19904026802
Other languages
German (de)
Inventor
Wolfgang Anger
Christian Ing Battlogg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANGER ELECTRONIC GmbH
Original Assignee
ANGER ELECTRONIC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANGER ELECTRONIC GmbH filed Critical ANGER ELECTRONIC GmbH
Priority to DE19904026802 priority Critical patent/DE4026802A1/en
Publication of DE4026802A1 publication Critical patent/DE4026802A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/44Compression means for making articles of indefinite length
    • B29C43/48Endless belts
    • B29C2043/483Endless belts cooperating with a second endless belt, i.e. double band presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/56Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425Printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60In a particular environment
    • B32B2309/68Vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1027Pressing using at least one press band
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/085Using vacuum or low pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Abstract

A PCB is covered with a film on one or both sides in a vacuum chamber. In the appts. used two continuous belts move together in the vacuum chamber to form the laminating gap between them and a heater acts on the laminate. A prefabricated PCB (12) is moved (8) together with its covering film(s) into the vacuum chamber (2) where the two conveyor belts (6,7) produce the laminating gap (18) between them. Between the two belts (6,7) there is a heater (10) and pressure ram (13) on each side. In operation the laminate is moved into position before the inlet and outlet (3,4) are closed and the vacuum is produced. The film(s) is hot pressed on to the PCB either by admitting atmospheric pressure or even higher pressure to the rams (13). The surfaced PCB is moved out of the chamber by opening its inlet/outlet (3,4) and activating the conveyor table (15). A pair of pressure rollers (16) can also be used in addn. e.g. to apply a further surfacing. The heating in the vacuum chamber (2) can alternatively be by h/f. ADVANTAGE - The equipment eliminates the formation of scrap material (unlike existing appts. for this purpose). It produces high grade laminates at a high output rate.

Description

The invention relates to a device for one-sided or double-sided lamination of a printed circuit board with a film in one Vacuum chamber. Such a device, also called a vacuum laminator is described, for example, in DE 25 44 553 A1. There the circuit board to be laminated is in a space laminated between an upper and a lower film, the films thus serve as a transport medium for the circuit board to be laminated. This known device works in such a way that, after by appropriate The two films drive the circuit board into the vacuum chamber was transported, the vacuum chamber is closed. she will then evacuated and the films are applied under air pressure pressed the plate to be laminated.

The disadvantage of this known device is in particular that a later cutting of the film, which was previously used as a means of transport served, leads to high film losses, because the film length always greater than the plate length or the length of the or to be laminated that must be films. So there is a relatively large amount of waste concealing films. Another disadvantage of this known device is there is sufficient pressurization of the coating PCB and possibly heating is difficult.

The present invention is therefore based on the object Develop device with the features mentioned above so that a fast and reliable while avoiding film waste Laminating the circuit board is possible.

To achieve the object, the invention is thereby  characterized in that continuous, endless in the vacuum chamber Conveyor belts are arranged with a lamination gap between them train for the transport of the pre-laminated circuit board, as well as a Heating device for the pre-laminated in the laminating gap Circuit board.

The film or films to be laminated are therefore no longer used as Means of transport for the circuit board, but sees separate for this endless conveyor belts. These will be in between you Formed laminated gap heated areal, which then the pre-laminated circuit board is laminated. Under a pre-laminated Printed circuit board is understood to be a printed circuit board on which the to be laminated The film has already been released and temporarily fixed, but not yet Laminating in the sense of a full-surface bond is achieved. Rather, this only takes place in the vacuum chamber. The lamination is also referred to as filming and pre-lamination accordingly as Filming.

There are two options for the formation of the heating device prefers. The first embodiment is characterized in that the Heating device is designed as at least one heating plate, the is movable perpendicular to the direction of transport and which is in the interior of the conveyor belt in question adjacent to that strand Conveyor belt is located, on which the circuit board rests. This will the relevant strand of the conveyor belt is sufficiently heated in order to to carry out the lamination. At the same time, the heating device practices necessary pressure for the lamination. It can also be different thick circuit boards or films are easily laminated in such a way because these thickness differences are absorbed by this device.

The other preferred embodiment is characterized in that the heating device is designed as at least one induction heater  which is arranged in the interior of the conveyor belt in question, the conveyor belt being designed to be inductively conductive.

These features also enable full-surface heating of the Laminating required area of the conveyor belt reached. The for The necessary pressure can also be laminated outside the vacuum chamber laminated circuit board can be exercised, for example by a heated pair of rollers. Or the pressure is through the conveyor belts yourself upset. The main advantage is that in the Heating position the heating through the conveyor belt Printed circuit board heated, but after lamination the heating plate is lifted off the conveyor belt using the vacuum chamber Atmospheric pressure or excess pressure is applied to the outlet lock and the inlet lock are opened, the laminated circuit board the vacuum chamber is transported out and the Conveyor belts run one complete cycle so that the previous one heated part of the run of the conveyor belt is now on top, d. H. outside the area of the laminating gap.

The lamination gap, which is thus free for the insertion of a new one PCB is, so it has an upper and lower cold run of the conveyor belt so that there are no signs of sticking, when a new circuit board to be laminated in the laminating gap is introduced.

This also applies to the design of the heating device according to claim 2.

The induction heater consists of an induction coil that - just like like the heating plate described above - each in the space between The respective conveyor belt is arranged, the conveyor belt is designed to be inductively conductive.

Appropriate current is applied to the induction coil the strand of the conveyor belt is heated, which is just the Laminating gap for the circuit board to be heated forms.  

The same advantages as described above are thus achieved, d. H. only the run of the conveyor belt is heated, whatever is located exactly opposite the circuit board. After done Lamination of the circuit board is in turn in the previous described way out of the vacuum chamber, the Conveyor belts again run half a turn, so now a cooled part of the strand of the respective conveyor belt Laminating gap for the next circuit board to be laminated forms.

It should also be noted that to carry out the lamination not only can atmospheric pressure be introduced into the vacuum chamber, but that even overpressure from z. B. 1 to 3 atmospheres initiated can be to a sudden and increased pressure on the film to reach the circuit board. This will make a higher one Surface pressure reached.

Another major advantage of the device described is that only a seal of the film on the circuit board under vacuum takes place, being in the space between the underside of the sealing film and the respective top of the circuit board the vacuum of the Vacuum chamber is enclosed.

It can now either be the final lamination process in the previous described manner take place in the vacuum chamber itself or it is in a development of the present invention provided that in Spout outside the vacuum chamber an additionally heated Laminating roller pair or another heat source (radiator etc.) is provided, which in a known manner under pressure and heat the final lamination.

Both are possible, i. H. the final lamination can be done in the Vacuum chamber itself or - according to the second  Possibility - it can be placed in the one behind the vacuum chamber Laminating roller pair or alternative heat source take place.

It is therefore an essential advantage of the method described here that can be worked in a continuous process so that no film waste occurs because the circuit boards are already pre-filmed in the Vacuum chamber can be inserted and that especially in one Continuous processing is done, which is a fast cyclical Processing of the printed circuit boards guaranteed.

Other advantages are that you can also load and unload the Can automate vacuum chamber, d. H. you can see the entire vacuum chamber switch to an automatic processing line.

Another advantage is that you can have multiple plates at the same time consecutively according to the maximum length of the chamber in can process a single operation in the chamber.

Another advantage is that the described pre-lamination in the Vacuum chamber a subsequent final lamination in the downstream Laminating roller pair can be shortened significantly, so that overall production times or processing times are reduced.

Because of the arrangement of two superimposed conveyor belts in The vacuum chamber also has a very compact vacuum chamber Contrary to known designs, for example, the two Use successive conveyor belts.

By designing a compact vacuum chamber, a faster application of the vacuum can be achieved and less Manufacturing costs for the machine itself.  

By initiating a brief overpressure before opening the locks an increased pressure of the film on the circuit board is achieved and thereby an adaptation of the film to the surface of the circuit board.

Another advantage is that in the present invention prefabricated vacuum can be used, d. H. in a cauldron first creates a vacuum and then there is a connection between the boiler and the vacuum chamber, creating the vacuum chamber is suddenly evacuated.

The invention will now be described with reference to an embodiment described. This results from the description and the drawing further advantages and features of the invention.

In the direction of the arrow 8 , a circuit board 12 pre-filmed on the top and bottom is transported into a vacuum chamber 2 via an inlet table 1 . Here, the inlet and outlet locks 3 , 4 are open.

In the interior 5 of the vacuum chamber 2 , two conveyor belts 6 , 7 are arranged one above the other. Each conveyor belt 6 has a circumferential cloth-like strand, which strand is deflected via corresponding deflection rollers 9 . The conveyor belts thus form a lamination gap 18 , which is formed by the lower run of the upper conveyor belt 6 and the upper run by the lower conveyor belt 7 .

The film is only placed on the circuit board 12 on the top and bottom, ie the circuit board is pre-filmed or laminated.

In the space between the respective conveyor belt 6 , 7 , a heating device is arranged, which essentially consists of a heating plate 10 and an associated pressure cylinder 13 .

Since the parts are exactly identical with respect to a horizontal longitudinal center line in the vacuum chamber 2 , it is sufficient for the further description if only the function of the upper parts in the vacuum chamber is described.

In order to pull in the printed circuit board 12 , each conveyor belt 6 is thus driven to rotate in the arrow directions 14 . As a result, the printed circuit board 12 is drawn into the laminating gap 18 and remains in the position shown in the figure.

The inlet and outlet locks 3 , 4 are then closed. The vacuum chamber 2 is then evacuated and, after the prescribed vacuum has been reached, the cylinders 13, 14 are acted upon, the heating plates 10 , 11 being heated continuously or intermittently. The films 13 are then guided against each other against the laminating gap 18 so that the heating plates rest on the respective run of the conveyor belt 6 , 7 and give their heating to the printed circuit board 12 via contact heat.

After reaching the required working temperature, the pressure cylinders 13 are acted on in the opposite direction, so that the heating plates 10 , 11 are lifted off the respective run of the conveyor belt 7 .

A valve (not shown in more detail) for the vacuum chamber 2 is then opened, so that either atmospheric pressure or even excess pressure is introduced into the vacuum chamber 2 . By applying this pressure there is an abrupt surface pressure on the heated and thermoplastic sealed film by the heating plates, so that the vacuum is trapped between the film and the top or between the film and the bottom of the circuit board.

The processing is finished in the vacuum chamber; the inlet and outlet locks 3 , 4 are then opened and the finished printed circuit board 12 is transported out via an outlet table 15 in the direction of arrow 17 .

As already mentioned at the beginning, a pair of laminating rollers 16 and / or a heating device can be arranged behind the outlet table 15 for the finished lamination in the outlet direction, which laminates further under pressure and heat.

As already mentioned at the beginning, an induction heater can be used in the vacuum chamber 2 instead of the heating arrangement described.

As soon as the circuit board 12 is transported in the direction of arrow 17 over the outlet table 15 , the conveyor belts 6 , 7 make a revolution in the direction of arrow 14 , so that the previously heated strand of the respective conveyor belt 6 , 7 now moves up and down in the vacuum chamber 2 and the lamination gap 18 is formed by a cold run of the respective conveyor belt 6 , 7 , in which a new printed circuit board is then drawn in. The same process then begins as previously described.

In a further development of the present invention, it is provided that instead of two opposing cylinders 13, 14, only a single cylinder, e.g. B. an upper pressure cylinder 13 is used and instead of the lower pressure cylinder 13 a rigid mounting of the lower heating plate 11 is provided. The upper cylinder 13 then presses the conveyor belt 6 downward against the lower stationary conveyor belt, so that contact heating and full-surface contact of the upper and lower heating plates 10 , 11 on the respective conveyor belts 6 , 7 also occur here.

The device described is in particular for laminating Printed circuit boards suitable for the application of photoresist dry films. This is a polyester film as a base material on which Plastic coatings are applied; these layers are either acrylic or epoxy or mixtures thereof in combination with photopolymer pigments.

These cover layers on finished etched circuit boards serve the purpose Soldering process, electrical insulation and the physical Protection.

Since in most cases (primarily) it is fully etched PCBs, the laminating process (heat sealing) must be under Vacuum take place to trap air between the tracks and To prevent drill holes.  

Drawing legend

1 infeed table
2 vacuum chamber
3 inlet lock
4 outlet lock
5 interior
6 conveyor belt
7 conveyor belt
8 direction of arrow
9 pulley
10 heating plate
11 heating plate
12 printed circuit board
13 printing cylinders
14 arrow direction
15 outlet table
16 pair of laminating rollers and heating
17 arrow direction
18 laminating gap

Claims (5)

1. Device for one-sided or double-sided lamination of a circuit board with a film in a vacuum chamber, characterized in that in the vacuum chamber ( 2 ) circumferential, endless conveyor belts ( 6 , 7 ) are arranged, which have a lamination gap ( 18 ) between them for transport the pre-laminated circuit board ( 12 ) and a heating device ( 10 ) for the pre-laminated circuit board ( 12 ) located in the laminating gap ( 18 ).
2. Apparatus according to claim 1, characterized in that the heating device is designed as at least one heating plate ( 10 ), can be moved perpendicular to the transport direction ( 17 ) and which is located in the interior of the relevant conveyor belt ( 6 , 7 ) adjacent to that strand of this conveyor belt , on which the circuit board ( 12 ) rests.
3. Apparatus according to claim 1 or 2, characterized in that the heating device ( 10 ) is designed as at least one induction heater, which is arranged in the interior of the relevant conveyor belt ( 6 , 7 ), the conveyor belt being designed to be inductively conductive.
4. Device according to one of claims 1 to 3, characterized in that a heated laminating roller pair ( 16 , 16 ) is arranged in the transport direction behind the vacuum chamber ( 2 ).
5. Device according to one of claims 1 to 4, characterized in that the pressure prevailing in the vacuum chamber ( 2 ) can be set (positive or negative pressure).
DE19904026802 1990-08-24 1990-08-24 Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure Withdrawn DE4026802A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19904026802 DE4026802A1 (en) 1990-08-24 1990-08-24 Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19904026802 DE4026802A1 (en) 1990-08-24 1990-08-24 Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure

Publications (1)

Publication Number Publication Date
DE4026802A1 true DE4026802A1 (en) 1992-02-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE19904026802 Withdrawn DE4026802A1 (en) 1990-08-24 1990-08-24 Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure

Country Status (1)

Country Link
DE (1) DE4026802A1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4222262A1 (en) * 1991-09-03 1993-03-04 Anger Electronic Gmbh Appts. for laminating plastics prods. e.g. PVC films esp. in PCB mfr. - has vacuum chamber comprising 2 opposing movable platens, each having pressure mat backed by heating mats for receiving prod connected by thin polyester band
DE4222267A1 (en) * 1991-09-19 1993-04-01 Anger Electronic Gmbh Equipment for laminating plastic films - comprises evacuated chamber with hinged top and fixed cooled base, contg. stack of films, rubber pressure cushion and e.g. heating mat
EP1366880A2 (en) * 2002-05-02 2003-12-03 Ballard Power Systems Inc. Belt feed apparatus for continuous expanded graphite web
EP1561387A2 (en) * 2004-02-04 2005-08-10 Maschinenfabrik Herbert Meyer GmbH & Co. KG Laminating device
US6971429B2 (en) * 1999-08-25 2005-12-06 Shipley Company, L.L.C. Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
WO2007135512A1 (en) * 2006-05-16 2007-11-29 Aibel As A method for fabricating a sheet-shaped electrode and a sheet-shaped electrode for an electrostatic coalescing device
EP2236287A3 (en) * 2009-03-31 2011-03-30 Spaleck-Stevens Inno Tech GmbH & Co. KG Lamination device
US7964079B2 (en) 2006-05-26 2011-06-21 Hamworthy Plc Electrostatic coalescing device
US8282804B2 (en) 2006-05-16 2012-10-09 Hamworthy Plc Electrostatic coalescing device
CN102951845A (en) * 2012-11-02 2013-03-06 成都工投电子科技有限公司 Single-side etching method for liquid crystal panel glass
CN107249261A (en) * 2017-07-17 2017-10-13 厦门弘信电子科技股份有限公司 FPC attaching process and its cover layer false sticker based on cover layer false sticker

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE447850C (en) * 1924-12-05 1927-08-06 Siemens Elektrowaerme Gmbh Electrical heating and baking device
DE2544553A1 (en) * 1974-10-08 1976-04-22 Du Pont Vacuum laminating
DE3247145A1 (en) * 1982-12-21 1984-07-05 Held Kurt Metal continuous press ribbon with structured surface for double band presses
EP0158027A2 (en) * 1984-04-10 1985-10-16 DIELEKTRA GmbH Method for making copper-clad base material for conductive plates
DE3400085A1 (en) * 1984-01-03 1985-11-14 Amerigo De Masi Apparatus for the simultaneous lamination on both sides of metal-coated plates of dielectric material with dry polymer films or of etched plate-shaped conductors
DE3737945A1 (en) * 1987-11-07 1989-05-24 Anger Wolfgang Vacuum laminator
DE3840704A1 (en) * 1987-12-02 1989-07-06 Mitsubishi Gas Chemical Co Method for producing a copper plated layer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE447850C (en) * 1924-12-05 1927-08-06 Siemens Elektrowaerme Gmbh Electrical heating and baking device
DE2544553A1 (en) * 1974-10-08 1976-04-22 Du Pont Vacuum laminating
DE3247145A1 (en) * 1982-12-21 1984-07-05 Held Kurt Metal continuous press ribbon with structured surface for double band presses
DE3400085A1 (en) * 1984-01-03 1985-11-14 Amerigo De Masi Apparatus for the simultaneous lamination on both sides of metal-coated plates of dielectric material with dry polymer films or of etched plate-shaped conductors
EP0158027A2 (en) * 1984-04-10 1985-10-16 DIELEKTRA GmbH Method for making copper-clad base material for conductive plates
DE3737945A1 (en) * 1987-11-07 1989-05-24 Anger Wolfgang Vacuum laminator
DE3840704A1 (en) * 1987-12-02 1989-07-06 Mitsubishi Gas Chemical Co Method for producing a copper plated layer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ECKHARDT, H.J.: Haftvermittlung zwischen Metall und Kunststoff mit Hilfe von induk- tiver Erwärmung. In: elektrowärme international 424.Aug., 1984, S.B195 *

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4222262A1 (en) * 1991-09-03 1993-03-04 Anger Electronic Gmbh Appts. for laminating plastics prods. e.g. PVC films esp. in PCB mfr. - has vacuum chamber comprising 2 opposing movable platens, each having pressure mat backed by heating mats for receiving prod connected by thin polyester band
DE4222267A1 (en) * 1991-09-19 1993-04-01 Anger Electronic Gmbh Equipment for laminating plastic films - comprises evacuated chamber with hinged top and fixed cooled base, contg. stack of films, rubber pressure cushion and e.g. heating mat
US6971429B2 (en) * 1999-08-25 2005-12-06 Shipley Company, L.L.C. Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
EP1366880A2 (en) * 2002-05-02 2003-12-03 Ballard Power Systems Inc. Belt feed apparatus for continuous expanded graphite web
EP1366880A3 (en) * 2002-05-02 2007-10-03 Ballard Power Systems Inc. Belt feed apparatus for continuous expanded graphite web
EP1561387A2 (en) * 2004-02-04 2005-08-10 Maschinenfabrik Herbert Meyer GmbH & Co. KG Laminating device
EP1561387A3 (en) * 2004-02-04 2006-05-31 Maschinenfabrik Herbert Meyer GmbH & Co. KG Laminating device
US8349153B2 (en) 2006-05-16 2013-01-08 Hamworthy Plc Method for fabricating a sheet-shaped electrode and a sheet-shaped electrode for an electrostatic coalescing device
GB2451356A (en) * 2006-05-16 2009-01-28 Aibel As A method for fabricating a sheet-shaped electrode and a sheet-shaped electrode for an electrostatic coalescing device
WO2007135512A1 (en) * 2006-05-16 2007-11-29 Aibel As A method for fabricating a sheet-shaped electrode and a sheet-shaped electrode for an electrostatic coalescing device
GB2451356B (en) * 2006-05-16 2011-05-11 Aibel As A method for fabricating a sheet-shaped electrode and a sheet-shaped electrode for an electrostatic coalescing device
US8282804B2 (en) 2006-05-16 2012-10-09 Hamworthy Plc Electrostatic coalescing device
US7964079B2 (en) 2006-05-26 2011-06-21 Hamworthy Plc Electrostatic coalescing device
EP2236287A3 (en) * 2009-03-31 2011-03-30 Spaleck-Stevens Inno Tech GmbH & Co. KG Lamination device
CN102951845A (en) * 2012-11-02 2013-03-06 成都工投电子科技有限公司 Single-side etching method for liquid crystal panel glass
CN102951845B (en) * 2012-11-02 2016-01-20 成都工投电子科技有限公司 A kind of one side engraving method of liquid crystal panel glass
CN107249261A (en) * 2017-07-17 2017-10-13 厦门弘信电子科技股份有限公司 FPC attaching process and its cover layer false sticker based on cover layer false sticker
CN107249261B (en) * 2017-07-17 2019-04-23 厦门弘信电子科技股份有限公司 Flexible circuit board attaching process and its cover film false sticker based on cover film false sticker

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