NL7511714A - PROCEDURE FOR APPLYING A PHOTORESIST FORMING COAT ON A SURFACE WITH RAISED AREAS. - Google Patents

PROCEDURE FOR APPLYING A PHOTORESIST FORMING COAT ON A SURFACE WITH RAISED AREAS.

Info

Publication number
NL7511714A
NL7511714A NL7511714A NL7511714A NL7511714A NL 7511714 A NL7511714 A NL 7511714A NL 7511714 A NL7511714 A NL 7511714A NL 7511714 A NL7511714 A NL 7511714A NL 7511714 A NL7511714 A NL 7511714A
Authority
NL
Netherlands
Prior art keywords
procedure
applying
raised areas
photoresist forming
forming coat
Prior art date
Application number
NL7511714A
Other languages
Dutch (nl)
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of NL7511714A publication Critical patent/NL7511714A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
NL7511714A 1974-10-08 1975-10-06 PROCEDURE FOR APPLYING A PHOTORESIST FORMING COAT ON A SURFACE WITH RAISED AREAS. NL7511714A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51311274A 1974-10-08 1974-10-08
US56890475A 1975-04-17 1975-04-17

Publications (1)

Publication Number Publication Date
NL7511714A true NL7511714A (en) 1976-04-12

Family

ID=27057750

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7511714A NL7511714A (en) 1974-10-08 1975-10-06 PROCEDURE FOR APPLYING A PHOTORESIST FORMING COAT ON A SURFACE WITH RAISED AREAS.

Country Status (5)

Country Link
JP (1) JPS5163702A (en)
DE (1) DE2544553C2 (en)
FR (1) FR2287714A1 (en)
GB (1) GB1517302A (en)
NL (1) NL7511714A (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069076A (en) * 1976-11-29 1978-01-17 E. I. Du Pont De Nemours And Company Liquid lamination process
JPS5489274A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of making printed board
US4289480A (en) * 1979-11-02 1981-09-15 E. I. Du Pont De Nemours And Company Process for heating thin surface layers
DE3342678C2 (en) * 1983-11-25 1995-08-31 Held Kurt Method and device for the continuous production of metal-clad laminates
JPS6252552A (en) * 1985-08-30 1987-03-07 Hitachi Chem Co Ltd Method and device for vacuum sticking
JPS63259559A (en) * 1987-04-16 1988-10-26 Hitachi Condenser Co Ltd Pattern forming method for printed circuit board
DE3737945A1 (en) * 1987-11-07 1989-05-24 Anger Wolfgang Vacuum laminator
US4834821A (en) * 1988-01-11 1989-05-30 Morton Thiokol, Inc. Process for preparing polymeric materials for application to printed circuits
NO890091L (en) * 1988-01-11 1989-07-12 Thiokol Morton Inc PROCEDURE AND DEVICE FOR AA APPLYING POLYMER MATERIALS ON PRINTED CIRCUITS.
US4992354A (en) * 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
US5078820A (en) * 1988-03-25 1992-01-07 Somar Corporation Method and apparatus for pressure sticking a thin film to a base plate
US4927733A (en) * 1988-12-23 1990-05-22 E. I. Du Pont De Nemours And Company Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing
DE4018177A1 (en) * 1990-06-07 1991-12-12 Anger Electronic Gmbh Continuous circuit board polymer film lamination - using multichamber vacuum cladding appts. to allow continuous one- or two-side cladding
DE4026802A1 (en) * 1990-08-24 1992-02-27 Anger Electronic Gmbh Equipment to surface PCB with film(s) - has conveyors to feed to and discharge from vacuum chamber contg. 2 endless belts with devices to apply heat and pressure
DE4222262A1 (en) * 1991-09-03 1993-03-04 Anger Electronic Gmbh Appts. for laminating plastics prods. e.g. PVC films esp. in PCB mfr. - has vacuum chamber comprising 2 opposing movable platens, each having pressure mat backed by heating mats for receiving prod connected by thin polyester band
DE9111708U1 (en) * 1991-09-19 1992-04-16 Anger Electronic Ges.M.B.H. Emco Innovationscenter, Hallein, At
IT1274181B (en) * 1994-05-18 1997-07-15 Amedeo Candore LAMINATION OF PHOTOSENSITIVE FILMS TO FORM A WELDING MASK ON PRINTED CIRCUIT BOARDS
DE19609590A1 (en) * 1996-03-12 1997-09-18 Kontron Elektronik Method and device for coating substrates, preferably printed circuit boards
MY120763A (en) 1997-09-19 2005-11-30 Hitachi Chemical Co Ltd Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer
EP1117006A1 (en) * 2000-01-14 2001-07-18 Shipley Company LLC Photoresist having increased photospeed
TWI262360B (en) 2001-03-29 2006-09-21 Hitachi Chemical Co Ltd Light sensitive film for forming circuit and method for manufacturing printed circuit board
US8801887B2 (en) 2005-12-23 2014-08-12 The Boeing Company Textured structure and method of making the textured structure
ES2503791T3 (en) * 2009-08-13 2014-10-07 Dow Global Technologies Llc A multilayer laminated structure and manufacturing method
WO2012082613A2 (en) 2010-12-17 2012-06-21 Dow Global Technologies Llc Improved photovoltaic device
CN113473709B (en) * 2020-03-31 2022-05-31 竞华电子(深圳)有限公司 Printed circuit board processing method and printed circuit board

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1293655B (en) * 1969-04-24
US3042574A (en) * 1957-09-25 1962-07-03 Du Pont Method of making laminated structures
NL302012A (en) * 1963-08-14
CA757597A (en) * 1963-12-30 1967-04-25 L. Mees John Method for making printed circuits
JPS4518324Y1 (en) * 1966-12-19 1970-07-27
JPS449363Y1 (en) * 1968-08-05 1969-04-16
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
DE1953883A1 (en) * 1969-10-25 1971-05-06 Dornbusch & Co Process for the surface welding of heated webs of material, in particular thermoplastic plastic foils, as well as device for carrying out the process
FR2123089B1 (en) * 1970-12-11 1974-08-23 Saint Gobain
JPS48100201A (en) * 1972-04-04 1973-12-18
JPS5129443B2 (en) * 1972-07-20 1976-08-25
JPS5434909B2 (en) * 1973-02-08 1979-10-30
JPS49103167A (en) * 1973-02-08 1974-09-30

Also Published As

Publication number Publication date
GB1517302A (en) 1978-07-12
DE2544553C2 (en) 1983-08-04
DE2544553A1 (en) 1976-04-22
FR2287714A1 (en) 1976-05-07
FR2287714B1 (en) 1982-10-15
JPS5513341B2 (en) 1980-04-08
JPS5163702A (en) 1976-06-02

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BB A search report has been drawn up
BC A request for examination has been filed
A85 Still pending on 85-01-01
BV The patent application has lapsed