JPS55127438A - Production of copper-clad laminate - Google Patents
Production of copper-clad laminateInfo
- Publication number
- JPS55127438A JPS55127438A JP3325679A JP3325679A JPS55127438A JP S55127438 A JPS55127438 A JP S55127438A JP 3325679 A JP3325679 A JP 3325679A JP 3325679 A JP3325679 A JP 3325679A JP S55127438 A JPS55127438 A JP S55127438A
- Authority
- JP
- Japan
- Prior art keywords
- silane
- polyethylene resin
- copper
- stacked
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: To produce copper-clad laminate which is inexpensive and excels in high- frequency characteristics, by a method wherein a base material treated with silane and a copper foil are stacked and compressed with heating to carry out simultaneously molding and crosslinking treatments.
CONSTITUTION: A silane-modified polyethylene resin film is prepared by reacting a polyethylene resin with a silane of the formula RR'SiY2 (wherein R is a monovalent olefinically unsaturated gp. which is bondend to Si by a Si-C linkage and consists of C and H and optionally O; R' is a monovalent hydrocarbon gp which does not contain an aliph. unsaturated bond or radical Y; Y is a hydrolyzable org. gp.) in the presence of a free radical-generating cpd. The silane-modified polyethylene resin film, a base material such as glass cloth, paper which is impregnated with a silanol condensation catalyst and/or epoxy resin prepreg contg. the silanol condensation catalyst and a copper foil are stacked and compressed under a pressure of 30W100kg/cm2 with heating at a temp. of 150W200°C in order to carryout simultaneously molding and crosslinking treatments.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54033256A JPS6049422B2 (en) | 1979-03-23 | 1979-03-23 | Manufacturing method for copper clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP54033256A JPS6049422B2 (en) | 1979-03-23 | 1979-03-23 | Manufacturing method for copper clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55127438A true JPS55127438A (en) | 1980-10-02 |
| JPS6049422B2 JPS6049422B2 (en) | 1985-11-01 |
Family
ID=12381417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP54033256A Expired JPS6049422B2 (en) | 1979-03-23 | 1979-03-23 | Manufacturing method for copper clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6049422B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3313579A1 (en) * | 1982-04-19 | 1983-10-20 | Sumitomo Bakelite Co. Ltd., Tokyo | METAL-LAMINATED LAMINATE AND METHOD FOR PRODUCING THE SAME |
| JPS6011354A (en) * | 1983-07-01 | 1985-01-21 | 住友ベークライト株式会社 | Composite laminated board |
| JPS61154940A (en) * | 1984-12-28 | 1986-07-14 | 住友ベークライト株式会社 | Manufacture of copper lined laminated board |
-
1979
- 1979-03-23 JP JP54033256A patent/JPS6049422B2/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3313579A1 (en) * | 1982-04-19 | 1983-10-20 | Sumitomo Bakelite Co. Ltd., Tokyo | METAL-LAMINATED LAMINATE AND METHOD FOR PRODUCING THE SAME |
| US4499145A (en) * | 1982-04-19 | 1985-02-12 | Sumitomo Bakelite Company Limited | Metal-clad laminate and process for producing the same |
| JPS6011354A (en) * | 1983-07-01 | 1985-01-21 | 住友ベークライト株式会社 | Composite laminated board |
| JPS61154940A (en) * | 1984-12-28 | 1986-07-14 | 住友ベークライト株式会社 | Manufacture of copper lined laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6049422B2 (en) | 1985-11-01 |
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