JPS55127053A - Onnchip trimming integrated circuit - Google Patents

Onnchip trimming integrated circuit

Info

Publication number
JPS55127053A
JPS55127053A JP2972080A JP2972080A JPS55127053A JP S55127053 A JPS55127053 A JP S55127053A JP 2972080 A JP2972080 A JP 2972080A JP 2972080 A JP2972080 A JP 2972080A JP S55127053 A JPS55127053 A JP S55127053A
Authority
JP
Japan
Prior art keywords
onnchip
integrated circuit
trimming integrated
trimming
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2972080A
Other languages
English (en)
Japanese (ja)
Inventor
Shii Dobukin Robaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Publication of JPS55127053A publication Critical patent/JPS55127053A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/055—Fuse

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP2972080A 1979-03-08 1980-03-08 Onnchip trimming integrated circuit Pending JPS55127053A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/018,815 US4225878A (en) 1979-03-08 1979-03-08 Integrated circuit on chip trimming

Publications (1)

Publication Number Publication Date
JPS55127053A true JPS55127053A (en) 1980-10-01

Family

ID=21789907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2972080A Pending JPS55127053A (en) 1979-03-08 1980-03-08 Onnchip trimming integrated circuit

Country Status (4)

Country Link
US (1) US4225878A (en, 2012)
JP (1) JPS55127053A (en, 2012)
DE (1) DE3008754A1 (en, 2012)
FR (1) FR2451105A1 (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276543A (ja) * 1985-09-28 1987-04-08 Fujitsu Ltd 半導体集積回路

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3030620A1 (de) 1980-08-13 1982-03-11 Siemens AG, 1000 Berlin und 8000 München Anordnung zur aenderung der elektrischen schaltungskonfiguration von integrierten halbleiterschaltkreisen
US4713599A (en) * 1985-01-04 1987-12-15 Motorola, Inc. Programmable trimmable circuit having voltage limiting
US4766366A (en) * 1985-01-04 1988-08-23 Motorola, Inc. Trimmable current source
SE448264B (sv) * 1985-12-19 1987-02-02 Ericsson Telefon Ab L M Anordninng for justering av impedansverdet hos ett impedansnet i en integrerad halvledarkrets
US4665356A (en) * 1986-01-27 1987-05-12 National Semiconductor Corporation Integrated circuit trimming
US4670721A (en) * 1986-03-21 1987-06-02 Cherry Semiconductor Corporation Relaxation oscillator integrated circuit having shortable zener diodes for adjusting discharge current
DE4042740B4 (de) * 1989-07-20 2004-09-09 Hitachi, Ltd. Sensor
DE4042719C2 (de) * 1989-07-20 2003-01-30 Hitachi Ltd Sensor
US5381034A (en) * 1992-04-27 1995-01-10 Dallas Semiconductor Corporation SCSI terminator
US5394019A (en) * 1993-08-09 1995-02-28 Analog Devices, Inc. Electrically trimmable resistor ladder
US5603172A (en) * 1994-11-14 1997-02-18 Maher; Richard J. Selectively reversible resilient plow blade and kit
JP2001074530A (ja) * 1999-09-01 2001-03-23 Mitsubishi Electric Corp 熱式流量計
US6472897B1 (en) 2000-01-24 2002-10-29 Micro International Limited Circuit and method for trimming integrated circuits
US6674316B2 (en) * 2002-04-12 2004-01-06 Texas Instruments Incorporated Methods and apparatus for trimming electrical devices
JP2009164373A (ja) * 2008-01-08 2009-07-23 Toshiba Corp 半導体装置
US8405448B2 (en) * 2011-06-10 2013-03-26 David R. Hall Capacitive discharge fuse programming apparatus and method
CN103531575A (zh) * 2013-10-23 2014-01-22 苏州贝克微电子有限公司 一种多重修整结构的集成电路

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3191151A (en) * 1962-11-26 1965-06-22 Fairchild Camera Instr Co Programmable circuit
US3848238A (en) * 1970-07-13 1974-11-12 Intersil Inc Double junction read only memory
US4016483A (en) * 1974-06-27 1977-04-05 Rudin Marvin B Microminiature integrated circuit impedance device including weighted elements and contactless switching means for fixing the impedance at a preselected value
IL47305A (en) * 1975-05-14 1978-07-31 Filtomat Water Filters For Agr Method and apparatus for effecting the cleaning of a fluid filter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276543A (ja) * 1985-09-28 1987-04-08 Fujitsu Ltd 半導体集積回路

Also Published As

Publication number Publication date
US4225878A (en) 1980-09-30
FR2451105A1 (fr) 1980-10-03
DE3008754A1 (de) 1980-09-11
FR2451105B1 (en, 2012) 1984-11-30
DE3008754C2 (en, 2012) 1989-01-19

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