JPS55127049A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55127049A
JPS55127049A JP3530879A JP3530879A JPS55127049A JP S55127049 A JPS55127049 A JP S55127049A JP 3530879 A JP3530879 A JP 3530879A JP 3530879 A JP3530879 A JP 3530879A JP S55127049 A JPS55127049 A JP S55127049A
Authority
JP
Japan
Prior art keywords
lead
covering
magnet
heat sink
counter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3530879A
Other languages
Japanese (ja)
Inventor
Tetsuo Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3530879A priority Critical patent/JPS55127049A/en
Publication of JPS55127049A publication Critical patent/JPS55127049A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE: To make assembly ready automatically by means of a magnet by providing a magnetic metal covering on the surface of a tip counter to the face whereat a lead support comes in contact with a semiconductor device.
CONSTITUTION: Copper is used for a slag lead 23 of a lead support 20, and a heat sink 22 is formed with a high nickel-dumet wire for sealing with a glass cylinder 4. A magnetic iron covering 5 is formed on the tip of the slag lead 23 counter to the heat sink 22. A presence of the covering 5 is available for automatic assembly by means of a magnet, and moreover a copper zone of the lead 23 is effective enough to give radiation and larger permissible power.
COPYRIGHT: (C)1980,JPO&Japio
JP3530879A 1979-03-26 1979-03-26 Semiconductor device Pending JPS55127049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3530879A JPS55127049A (en) 1979-03-26 1979-03-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3530879A JPS55127049A (en) 1979-03-26 1979-03-26 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55127049A true JPS55127049A (en) 1980-10-01

Family

ID=12438154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3530879A Pending JPS55127049A (en) 1979-03-26 1979-03-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55127049A (en)

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