JPS55127049A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS55127049A JPS55127049A JP3530879A JP3530879A JPS55127049A JP S55127049 A JPS55127049 A JP S55127049A JP 3530879 A JP3530879 A JP 3530879A JP 3530879 A JP3530879 A JP 3530879A JP S55127049 A JPS55127049 A JP S55127049A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- covering
- magnet
- heat sink
- counter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To make assembly ready automatically by means of a magnet by providing a magnetic metal covering on the surface of a tip counter to the face whereat a lead support comes in contact with a semiconductor device.
CONSTITUTION: Copper is used for a slag lead 23 of a lead support 20, and a heat sink 22 is formed with a high nickel-dumet wire for sealing with a glass cylinder 4. A magnetic iron covering 5 is formed on the tip of the slag lead 23 counter to the heat sink 22. A presence of the covering 5 is available for automatic assembly by means of a magnet, and moreover a copper zone of the lead 23 is effective enough to give radiation and larger permissible power.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3530879A JPS55127049A (en) | 1979-03-26 | 1979-03-26 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3530879A JPS55127049A (en) | 1979-03-26 | 1979-03-26 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55127049A true JPS55127049A (en) | 1980-10-01 |
Family
ID=12438154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3530879A Pending JPS55127049A (en) | 1979-03-26 | 1979-03-26 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55127049A (en) |
-
1979
- 1979-03-26 JP JP3530879A patent/JPS55127049A/en active Pending
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