JPS5512327A - Method of fabricating heat pipe wick - Google Patents
Method of fabricating heat pipe wickInfo
- Publication number
- JPS5512327A JPS5512327A JP8345678A JP8345678A JPS5512327A JP S5512327 A JPS5512327 A JP S5512327A JP 8345678 A JP8345678 A JP 8345678A JP 8345678 A JP8345678 A JP 8345678A JP S5512327 A JPS5512327 A JP S5512327A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- green sheet
- paste
- microns
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: To provide a method of regularly fabricating a heat pipe wick which comprises the steps of: printing a plurality of stripes by paste on the surface of a green sheet containing an inorganic powder, repeating the application of a paste or a green sheet thereon, and sintering the same.
CONSTITUTION: An organic binder is added to a ceramic powder consisting of for example, 90% of α-AI2O3, 6% of SiO2 and 4% of MgO, and the mixture is kneaded and extruded in the shape of a sheet and dried. On the thus prepared green sheet 1 there are printed stripes 2 forming a wick layer having a width of 150 microns and a thickness of 30 microns by a mixed paste consisting of 100 parts of fine granular carbon, 20 parts of a polyvinyl butyral resin, 10% of a plasticizer phthalic acid ester, and 50 parts of butyl carbitol, through a silk screen. After drying the green sheet, on the printed surfaces thereof there is applied and printed a paste consisting of 100 parts of a ceramic powder having a composition same as that of the ceramic green sheet 1, 6 parts of a polyvinyl butyl resin, 4 parts of an ester, and 30 parts of bitol at parts corresponding to the evaporating part 4 and condensing part 5 with opening parts 6 and 6a of a diameter of 120 microns. Then, the sheet is sintered at a temperature of 1550°C and at the holding time of 1 hour to fabricate a heat pipe having a hollow wick layer.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8345678A JPS5512327A (en) | 1978-07-07 | 1978-07-07 | Method of fabricating heat pipe wick |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8345678A JPS5512327A (en) | 1978-07-07 | 1978-07-07 | Method of fabricating heat pipe wick |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5512327A true JPS5512327A (en) | 1980-01-28 |
Family
ID=13802948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8345678A Pending JPS5512327A (en) | 1978-07-07 | 1978-07-07 | Method of fabricating heat pipe wick |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5512327A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG120884A1 (en) * | 2001-08-28 | 2006-04-26 | Advanced Materials Tech | Advanced microelectronic heat dissipation package and method for its manufacture |
CN103712496A (en) * | 2012-10-09 | 2014-04-09 | 元镫金属股份有限公司 | Thin composite-type guide plate pipe |
-
1978
- 1978-07-07 JP JP8345678A patent/JPS5512327A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG120884A1 (en) * | 2001-08-28 | 2006-04-26 | Advanced Materials Tech | Advanced microelectronic heat dissipation package and method for its manufacture |
CN103712496A (en) * | 2012-10-09 | 2014-04-09 | 元镫金属股份有限公司 | Thin composite-type guide plate pipe |
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