JPS55123156A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS55123156A
JPS55123156A JP2988479A JP2988479A JPS55123156A JP S55123156 A JPS55123156 A JP S55123156A JP 2988479 A JP2988479 A JP 2988479A JP 2988479 A JP2988479 A JP 2988479A JP S55123156 A JPS55123156 A JP S55123156A
Authority
JP
Japan
Prior art keywords
diode
soldered
polarity
pellets
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2988479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5756218B2 (en, 2012
Inventor
Tadashi Sakagami
Shinji Kanazawa
Kazutoyo Narita
Noboru Kawasaki
Motoji Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP2988479A priority Critical patent/JPS55123156A/ja
Publication of JPS55123156A publication Critical patent/JPS55123156A/ja
Publication of JPS5756218B2 publication Critical patent/JPS5756218B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)
  • Die Bonding (AREA)
JP2988479A 1979-03-16 1979-03-16 Manufacture of semiconductor device Granted JPS55123156A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2988479A JPS55123156A (en) 1979-03-16 1979-03-16 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2988479A JPS55123156A (en) 1979-03-16 1979-03-16 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS55123156A true JPS55123156A (en) 1980-09-22
JPS5756218B2 JPS5756218B2 (en, 2012) 1982-11-29

Family

ID=12288393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2988479A Granted JPS55123156A (en) 1979-03-16 1979-03-16 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS55123156A (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524708A1 (fr) * 1982-04-02 1983-10-07 Mitsubishi Electric Corp Dispositif pour le refroidissement d'elements a semi-conducteurs

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS643120U (en, 2012) * 1987-06-24 1989-01-10

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4114748Y1 (en, 2012) * 1964-01-17 1966-07-09
JPS5177173A (en) * 1974-12-27 1976-07-03 Tokyo Shibaura Electric Co Handotaisochino tanshikozo

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4114748Y1 (en, 2012) * 1964-01-17 1966-07-09
JPS5177173A (en) * 1974-12-27 1976-07-03 Tokyo Shibaura Electric Co Handotaisochino tanshikozo

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524708A1 (fr) * 1982-04-02 1983-10-07 Mitsubishi Electric Corp Dispositif pour le refroidissement d'elements a semi-conducteurs

Also Published As

Publication number Publication date
JPS5756218B2 (en, 2012) 1982-11-29

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